Surface roughness effects on electromechanical performance of RF-MEMS capacitive switches

Nawaz, Hamid; Masood, Muhammad Umar; Saleem, Muhammad Mubasher; Iqbal, Javaid; Zubair, Muhammad

doi:10.1016/j.microrel.2019.113544

Cited by 20 publications

(8 citation statements)

References 47 publications

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“…Additionally [38], and [162] provided detailed parametric studies on the dynamical responses of the switches, revealing that surface adhesion force can slow the switching speed in the breaking contact state and that fast contact opening time occurs with a critical threshold of contact force. Similar results were also found in [155,159,161,163,193] and [234]. On the other hand, to mitigate bouncing phenomena [39,117,164], employed the soft-landing waveform optimization technique, which tries to lower the impact velocity by leveraging pull-in phenomena and minimizing switch bounces.…”

Section: Rf Switches and Inertial Force Switchessupporting

confidence: 59%

“…In general, the dry and wet etching and material deposition in the processes would cause imperfect washboard/scalloping pattern [246] and rough surface on the contact sidewall. These fabrication imperfections significantly affect the real roughness [193] and the velocity dependent sliding friction force [247], all of which have not been fully included in the modeling of MEMS vibro-impact systems to date.…”

Section: Discussionmentioning

confidence: 99%

“…The FETD method is popular in the MEMS field using commercial software, such as RF switches using ANSYS [39,40,193] and COMSOL Multiphysics [164]. The FDTD method has also been used in studying the time-dependent behavior of switches [37,155,[159][160][161][162] and tapping-mode AFM [148,149].…”

Section: Finite Difference Methods and Finite Element Methodsmentioning

confidence: 99%

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Micromechanical vibro-impact systems: a review

Tsai

2023

J. Micromech. Microeng.

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Spurred by the invention of the tapping-mode atomic force microscopy three decades ago, various micromechanical structures and systems that utilize parts with mechanical impact have been proposed and developed since then. While sharing most of the dynamical characteristics with macroscopic vibro-impact systems and benefiting from extensive theories developed, microscale counterparts possess higher percentage of surface force, higher resonance frequency and Q, and more prominent material and structural nonlinearities, all of which lead to unique features and in turn useful applications not seen in macroscopic vibro-impact systems. This paper will first present the basics of vibro-impact systems and techniques used for analyzing their nonlinear behaviors and then review the contact force modeling with an emphasis in microscale and numerical analysis tools. Finally, various applications of microscale vibro-impact systems will be reviewed and discussed. This review aims to provide a comprehensive picture of MEMS vibro-impact systems and inspire more innovative applications that take full advantage of the beauty of nonlinear vibro-impact dynamics in the microscale.

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Section: Rf Switches and Inertial Force Switchessupporting

confidence: 59%

Section: Discussionmentioning

confidence: 99%

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Micromechanical vibro-impact systems: a review

Tsai

2023

J. Micromech. Microeng.

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“…Micromachines 2020, 11, x 2 of 13 surface roughness also affects the contact performance of MEMS switches [12]. In addition, some researchers found that surface quality has an effect on the electromechanical performance of RF-MEMS capacitive switches, and the poor surface quality reduces down-state capacitance of RF-MEMS capacitors [13,14]. Therefore, excellent surface quality is very important for silicon wafer used in micromachines.…”

Section: Dielectrophoresis Polishing Methodsmentioning

confidence: 99%

Orthogonal Experimental Research on Dielectrophoresis Polishing (DEPP) of Silicon Wafer

et al. 2020

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Silicon wafer with high surface quality is widely used as substrate materials in the fields of micromachines and microelectronics, so a high-efficiency and high-quality polishing method is urgently needed to meet its large demand. In this paper, a dielectrophoresis polishing (DEPP) method was proposed, which applied a non-uniform electric field to the polishing area to slow down the throw-out effect of centrifugal force, thereby achieving high-efficiency and high-quality polishing of silicon wafers. The principle of DEPP was described. Orthogonal experiments on important polishing process parameters were carried out. Contrast polishing experiments of silicon wafer were conducted. The orthogonal experimental results showed that the influence ratio of electric field intensity and rotation speed on material removal rate (MRR) and surface roughness was more than 80%. The optimal combination of process parameters was electric field intensity 450 V/mm, rotation speed 90 rpm, abrasive concentration 30 wt%, size of abrasive particle 80 nm. Contrast polishing experiments indicated that the MRR and material removal uniformity of DEPP were significantly better than traditional chemical mechanical polishing (CMP). Compared with the traditional CMP, the MRR of DEPP was increased by 17.6%, and the final surface roughness of silicon wafer reached Ra 0.31 nm. DEPP can achieve high-efficiency and high-quality processing of silicon wafer.

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“…42 As in the RF spectrum, we have sufficient dimensions and can achieve tunability by using passive elements like varactor diodes 43,44 or using micro-electronic mechanical systems (MEMS) technology. [45][46][47] But in the optical regime due to the limited sizes passive elements can not be used to achieve tunability so for that purpose birefringent materials 48,49 like liquid crystals [50][51][52][53][54] or phase change materials are being deployed. [55][56][57] In our study, we have proposed a fluid-infiltrated RIS that is capable of giving 2 different focal points after changing the amount of fluid that is infiltrating the metalens.…”

Section: Introductionmentioning

confidence: 99%

Fluid-infiltrated on-axis ultra-compact reconfigurable intelligent surface for application of free-space optical communication

Khalid,

Mahmood,

Mehmood

et al. 2023

Nanophotonics and Micro/Nano Optics IX

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Free space optical (FSO) communication is an evolving technology that opens up the doors to use huge unlicensed bandwidth and can manifest high-speed communication. As the radio frequency spectrum is getting overburdened and unable to meet the ever-increasing demands of the internet, the optical spectrum can prove to be a paradigm shift to achieve the KPIs of communication including high data-rates, low latency and efficiency. In our study, a fluid-infiltrated reconfigurable intelligent surface (RIS) has been proposed that is proficient in directing the light on the concerned user. We proposed the integration of RIS in FSO communication to simultaneously enhance the data transmission range and acquire reconfigurability on run-time. Our proposed design can provide the communication link to the legitimate user while blocking the eavesdropper's reception. The proposed miniaturesized surface is envisaged to be an efficient meta-device for dynamic applications in FSO Communication.

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Surface roughness effects on electromechanical performance of RF-MEMS capacitive switches

Cited by 20 publications

References 47 publications

Micromechanical vibro-impact systems: a review

Micromechanical vibro-impact systems: a review

Orthogonal Experimental Research on Dielectrophoresis Polishing (DEPP) of Silicon Wafer

Fluid-infiltrated on-axis ultra-compact reconfigurable intelligent surface for application of free-space optical communication

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