Surface Tension and Density Measurements of Sn-Ag-Sb Liquid Alloys and Phase Diagram Calculations of the Sn-Ag-Sb ternary system

Abstract

The maximum bubble pressure method has been used to measure the surface tension of pure antimony and the surface tension and density (dilatometric method) of Sn-3.8 at%Ag eutectic base alloys with 0.03, 0.06 and 0.09 molar fraction of antimony at a temperature range from 550 to 1200 K. The linear dependencies of surface tension and density on temperature were observed and they were described by straight-line equations. Moreover, experimental determination of phase diagram and thermodynamic calculations in the Sn-Ag-Sb system were performed and the resulting optimized thermodynamic parameters were used for modeling of the surface tension. In addition, a non-equilibrium solidification process using the Scheil model was simulated and compared with the equilibrium solidification behavior of a Sn-Ag-Sb alloy.

Wettability Studies of Pb-Free Soldering Materials

“…The maximum bubble-pressure method has been used for surface-tension measurements and the dilatometric technique for density. Some details of the experimental methods have been presented in [5]. In general, the temperature dependence of the surface tension and density over an extensive range is linear, and, therefore, the least-squares method has In recent years, two main substitute materials for Sn-Pb traditional solders have been recommended for practical applications based not only on limited wettability data, but also taking into consideration the mechanical and electrical properties [6].…”

Phase Diagrams and Their Applications in Pb‐Free Soldering

“…Both experimental and thermodynamic modeling results are usually available for most of the binary solder-related phase diagrams; however, information regarding the ternary and higherordersystemsisrelativelylimited.Experimentalphaseequilibriummeasurementsareavailable for Sn-Ag-Au [19][20][21][22], Sn-Ag-Cu [23][24][25][26][27], Sn-Ag-Ni [28], Sn-Bi-Au [29], Sn-Bi-Ag [30,31], Sn-Bi-Cu [32], Sn-Bi-Fe [33], Sn-Bi-Ni [34], Sn-Cu-Au [35], Sn-Cu-Ni [36,37], Sn-In-Au [38], Sn-In-Cu [39], Sn-In-Ag [40], Sn-In-Ni [41], Sn-Sb-Ag [12,[42][43][44], Sn-Sb-Au [45], Sn-Zn-Ag [46], Sn-Zn-Bi [47], and Sn-Zn-Cu [48], and Sn-Ag-Cu-Ni [49,50] systems. As for lead-free soldering, there are some commercial thermodynamics databases, such as COST531 database [51], NIST solder database [52] and ADAMIS database [53].…”

Database of Pb - free soldering materials, surface tension and density, experiment vs. Modeling

“…In Table 1 there are summarized the updated investigated systems with references: (Gąsior, Moser & Pstruś, 2001); (Moser, Gąsior & Pstruś, 2001a); (Moser, Gąsior, Pstruś, Zakulski, Ohnuma,. Liu et al, 2001c); (Moser, Gąsior & Pstruś, 2001b); (Gąsior, Moser, & Pstruś, 2003a); (Moser, Gąsior, Ishida, Ohnuma, Liu, Bukat et al, 2005b); (Pamies, Garcia-Cordovilla & Louis, 1984) (Nogi, Oishi & Ogino, 1989); (Gąsior, Moser & Dębski, 2004c); (Liu, Inohana, Ohnuma, Kainuma, Ishida, Moseret al, 2002); (Gąsior, Moser, Pstruś, Krzyżak & Fitzner, 2003b); ; (Moser, Gąsior & Pstruś, 2005a); (Gąsior, Moser, Pstruś, Bukat, Kisiel & Sitek, 2004e); (Moser, Gąsior, Pstruś & Księżarek, 2002); (Moser, Gąsior, Pstruś, Ishihara, Liu, Ohnuma et al, 2004d); (Gąsior, Moser & Pstruś, 2004b); (Moser, Gąsior, Ishida, Ohnuma, Bukat, Pstruś et al, 2004c); (Gąsior, Moser, Bukat, Pstrus, Sitek, & Kisiel, 2004d); (Kisiel, Gąsior, Moser, Pstruś, Bukat & Sitek, 2005). (Gąsior et al, 2001) Pb -Sn (Gąsior et al, 2001) (Sn-Ag) eut +Zn * Sn (Moser et al, 2001a) Ag -Sn (Moser et al, 2001a) (Sn-Ag) eut +In (Liu et al, 2002) In (Moser et al, 2001c) Ag -In (Moser et al, 2001c) (Sn-Ag) eut +Bi (Moser et al, 2001b) Ag (Moser et al, 2001c) Bi -Sn ) (Moser et al, 2001b) (Sn-Ag) eut +Cu (Gąsior et al, 2004e) ) Bi (Moser et al, 2001b) In -Sn (Liu et al, 2002) (Sn-Ag) eut +Sb Sb (Gąsior et al, 2003a) Ag -Bi …”