Surface tension measurements of the Bi-Sn and Sn-Bi-Ag liquid alloys

Moser, Z.; Gąsior, W.; Pstruś, J.

doi:10.1007/s11664-001-0136-6

Cited by 73 publications

(37 citation statements)

References 23 publications

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“…The works [12,13] cover the temperature range of the present measurements, whereas the alloy compositions are quite different. The Ag 3.46 Bi 9 Sn 87.54 alloy [10] has a composition very close to Ag 3.33 Bi 10 Sn 86.67 , one of the alloys investigated in the present study, and their values of the density and surface tension are comparable as well ( Table 2). Table 1 Surface tension and density together with the corresponding temperature coefficients of Sn-rich ternary liquid alloys of the Ag-Bi-Sn system [12] by up to 1.2 % ( Table 2).…”

Section: Surface Tension and Densitysupporting

confidence: 66%

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Surface properties and wetting characteristics of liquid Ag–Bi–Sn alloys

et al. 2012

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Section: Surface Tension and Densitysupporting

confidence: 66%

“…The density and surface tension experimental data for liquid Ag-Bi-Sn alloys have been reported elsewhere [10,12,13]. The works [12,13] cover the temperature range of the present measurements, whereas the alloy compositions are quite different.…”

Section: Surface Tension and Densitymentioning

confidence: 86%

Surface properties and wetting characteristics of liquid Ag–Bi–Sn alloys

et al. 2012

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“…It was also already shown that bismuth and silver can have a significant impact on the corrosion properties in case of Sn-based solder alloy in NaCl solutions [17,18]. Furthermore, the influence of bismuth addition on the microstructure and the properties of Sn-rich SnAg lead-free solders has been also widely studied [13,[19][20][21][22][23]. However, the effect of bismuth on the corrosion behaviour in the case of micro-alloyed solder alloy is not deeply addressed in the literature.…”

Section: Discussionmentioning

confidence: 99%

Effect of Bismuth and Silver on the Corrosion Behavior of Lead-free Solders in 3.5 wt% NaCl Solution

Tamasi

Kosa

Szabó

et al. 2016

Period. Polytech. Elec. Eng. Comp. Sci.

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IntroductionOne of the key reliability issues of the electronics technology is carry about the solder joints testing. Usually, the different failures can lead back to the not adequate physical properties (e.g. wetting behaviour, mechanical strength, etc.) of the solder alloy and/or the not adequate applied technological processes (e.g. reflow temperature profile), which have to be improved. This challenge was updated in 2006, with the introduction of lead-free solder alloys governed by the RoHS directive of EU [1]. Due to the lead-free limitations, different solder types such as near-eutectic Tin-Silver, Tin-Copper, and Tin-Zinc alloys were produced as replacement for Tin-Lead solder materials. Furthermore, solders with more alloying elements, such as (Tin-Silver-Copper, Tin-Zinc-Silver, Tin-Zinc-Indium) and/or (Tin-Zinc-Silver-Aluminum, Tin-Silver-Bismuth-Copper, TinIndium-Silver-Antimony) were also investigated as replacements for Pb-free types [2]. While, the different qualifying studies of the Pb-free solder alloys are even active topics [3] and one of the issues is carry about humidity induced failures, like electrochemical corrosion [4,5]. Different results were also published related to novel Pb-free solder alloys in terms of reliability topics, such as solderability [6], intermetallic layer (IML) investigation [7], shear force tests [8], wetting investigations [9] or (solid state physics) migration tests [10]. On the other hand, the investigations of humidity induced failures (like corrosion) of Pb-free solder alloys are not deeply addressed in the scientific publications. In our former publication [11], various microalloyed Pb-free solders tested in terms of corrosion resistance using electroanalytical tests. In that study [11] different Pb-free solder alloys (four micro-alloyed and a Sn96.5Ag3Cu0.5 alloy as reference) were compared using potentiodynamic polarisation tests. During polarisation tests, the sample (working electrode) is scanned from a cathodic polarisation state, and after reaching the corrosion potential (Ecorr) it begins anodic polarisation. When the sample reaches the passivation potential, if possible a passivation film begins to form on the surface and the current density at this point is called the critical current density (Icrit). After this point the corrosion current density begins to drop to a much lower value. When a compact passivation film

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“…In earlier publications, [17][18][19][20][21], a qualitative agreement was observed between the experimental and the calculated surface tensions from Butler's model; however, the calculations have shown the increase of the surface tension vs. temperature (the positive temperature coefficient), the reasonable differences between the experimental and modelled data and also the curvilinear dependence of the surface tension vs. temperature (sometimes with the maximum) while from the experiment the straight line dependence vs. T with the negative value of temperature coefficient was observed. This was the main reason of the discussion of that problem conducted in [22] and [23].…”

Section: Surface Tension Modellingmentioning

confidence: 99%

Influence of Zinc on the Surface Tension, Density and Molar Volume of (Ag-Sn)eut +Zn Liquid Alloys

Gąsior¹,

Pstruś²,

Moser³

2016

Archives of Metallurgy and Materials

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The dilatometric and maximum bubble pressure methods were applied for the measurements of the density and surface tension of liquid (Ag-Sn)eut+Zn lead-free solders. The experiments were carried out in the temperature range from 515 to 1223 K for the alloys of the zinc concentration equaling 0.01, 0.02, 0.04, 0.05, 0.1 and 0.2 of the mole fraction. It was found that the temperature dependence of both the density and the surface tension could be thought as linear, so they were interpreted by straight line equations. The experimental data of the molar volume of the investigated alloys were described by the polynomial dependent on the composition and temperature.Calculations of the surface tension by Butler’s equation were conducted and confronted with the experimental data. Some significant deviations between the experimental and the calculated surface tension were observed. They reached almost 40 mNm-1. The observed changes of the density and surface tension caused by the zinc addition to the Ag-Sn eutectic were discussed with the consideration of the thermodynamic properties and the influence of a small quantity of impurities in a protective gas atmosphere.

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Surface tension measurements of the Bi-Sn and Sn-Bi-Ag liquid alloys

Cited by 73 publications

References 23 publications

Surface properties and wetting characteristics of liquid Ag–Bi–Sn alloys

Surface properties and wetting characteristics of liquid Ag–Bi–Sn alloys

Effect of Bismuth and Silver on the Corrosion Behavior of Lead-free Solders in 3.5 wt% NaCl Solution

Influence of Zinc on the Surface Tension, Density and Molar Volume of (Ag-Sn)eut +Zn Liquid Alloys

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