Surfactant Effects in Cu-Sn Alloy Deposition

Survila, Arvydas; Mockus, Z.; Kanapeckaitė, S.; Bražinskienė, Dalia

doi:10.1149/1.3649925

Cited by 3 publications

(3 citation statements)

References 27 publications

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“…4 shows XRD patterns of the coatings deposited in different agitation modes. The results show that the metallic matrix of obtained alloys is a single-phase substitutional solid solution of tin in copper [22] , [66] . Due to a small thickness of the coating (ca.…”

Section: Resultsmentioning

confidence: 90%

Ultrasonic-assisted electrodeposition of Cu-Sn-TiO2 nanocomposite coatings with enhanced antibacterial activity

Kharitonov

Kasach

Sergievich

et al. 2021

Ultrasonics Sonochemistry

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Highlights Cu–Sn–TiO 2 nanocomposite coatings were electrodeposited under mechanical and ultrasonic agitation; Effect of TiO 2 nanoparticles and current density on structural and antibacterial properties was investigated. Distribution of TiO 2 in the coatings improved under ultrasonic agitation; Antibacterial activity of Cu–Sn–TiO 2 coatings was enhanced by ultrasonic agitation.

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Section: Resultsmentioning

confidence: 90%

Ultrasonic-assisted electrodeposition of Cu-Sn-TiO2 nanocomposite coatings with enhanced antibacterial activity

Kharitonov

Kasach

Sergievich

et al. 2021

Ultrasonics Sonochemistry

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“…In addition, tin is known to be affected by the suppressors in the copper additive package. 12 Therefore, LSV was used to evaluate the effect of Sn on the copper deposition with additives.…”

Section: Resultsmentioning

confidence: 99%

“…11 In addition, the presence of the tin on the surface of the deposited Cu can also possibly change the adsorption of accelerator, which is critical for superfilling. 12 There are only a small number of studies of the electrodeposition of copper alloys for damascene applications of trench filling. 13,14 This study uses existing copper organic additives to control very low levels of tin incorporation in the electrodeposited Cu films without significantly changing the bath chemistry or concentration.…”

mentioning

confidence: 99%

Tin Incorporated in Copper Films during Damascene Copper Electrodeposition

Kitayaporn¹,

Huang²,

Hopstaken³

et al. 2014

J. Electrochem. Soc.

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Incorporation of a small amount of a secondary metal element such as tin, indium or aluminum into copper interconnects structures has been shown to improve the device reliability and electromigration. In this study, the incorporation of tin during copper damascene plating was investigated at conditions that allow void-free filling. The study focused on the effects of the additive package used, the current density, and the feature size on the tin incorporation. The Sn concentration in Cu was found to increase with the non-metallic impurity levels. Because the plating chemistry and plating current have strong impacts on the incorporation of the non-metallic impurities, they were also found to change the Sn incorporation. For example, Cu films plated at a lower current density, which showed higher non-metallic impurity levels, were also found to incorporate more Sn, opposite to the expectation from the more negative reversible potential of Sn. In addition, the Sn incorporation is also higher in narrow lines as compared with overburden films which, correlate well to findings for non-metallic impurity levels. By combining a plating chemistry which results in high non-metallic impurity levels and a low current density, 60nm wide Cu lines with up to about 0.1% Sn were plated, a 10-fold increase from the overburden film.

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