Surfing the Millimeter-Wave: Multilayer Photoimageable Technology for High Performance SoP Components in Systems at Millimeter-Wave and Beyond

Samanta, Kamal K.; Robertson, I.D.

doi:10.1109/mmm.2015.2487898

Cited by 14 publications

(8 citation statements)

References 48 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Fig. 4c illustrates the measured attenuation of SIW from 50 to 180 GHz (V, W, and D-band) for a cavity height of only 60 µm [23]. It shows a low loss of ∼0.2 dB/mm at 110 GHz and 0.75 dB/mm at 180 GHz, and also is in good agreement with the EMsimulated results of V-band and W-band SIWs shown in Fig.…”

Section: Siw Up To 180 Ghz In Advanced Multilayer Thickfilm Technologysupporting

confidence: 82%

“…Since both the dielectric and the conductor layers Table 1. The fabrication processing is straightforward, cost-effective, and yet achieves conductor widths/gaps of 10/15 μm (in place of ∼ 75/100 µm for LTCC) for realising precisely defined lumped components and other passives with remarkably high density and SRF [23]. The process can comfortably realise trench-filled continuous metal wall for mm-wave and sub-mm-wave SIW components or subsystem isolation walls (Figs.…”

Section: Some Of the Special Process Capabilitiesmentioning

confidence: 99%

“…3a). Some of the circuit techniques used for SIW are multilayer monolithic integrated circuit (MMIC), post-wall waveguide, laminated waveguide, LTCC waveguide, standard MIC, and multilayer photoimageable thick-film technology [16][17][18][19]23]. Out of these techniques (except lossy MMIC), the multilayer photoimageable technique provides a unique capability that allows the formation of trench-filled continuous metal (silver) sidewalls (contrary to fence-post), essential for higher mm-wave and sub-mm-wave applications, as depicted in Fig.…”

Section: Siw Up To 180 Ghz In Advanced Multilayer Thickfilm Technologymentioning

confidence: 99%

“…Conventionally, MCM fabrications, including widely preferred ceramic/low-temperature co-fired ceramic (LTCC), have used thick-film technology. Unfortunately, the thick-film technology does not allow the fabrication of precise geometries or trench-filled via (for the continuous metal wall) to realise passive components or SIW efficiently with the required feature size and quality for mm-wave applications [19][20][21][22][23].…”

Section: Introductionmentioning

confidence: 99%

“…The technology successfully demonstrated realisation of a highly compact 60 GHz MCM receiver integrating MMICs with embedded passive antenna and filter [5], and shown suitability for cost-effective mm-wave MCM and SiP [5,19] applications. The process has previously been used for realising a wide range of lumped components with high Q and self-resonance frequency (SRF) [24] and a range of passive components, including couples, filters, and antennas, and circuits with remarkably high performance and miniaturisation [23][24][25][26][27][28]. Further, the materials (dielectric/conductor) have been characterised [13,23] and the initial results for planar transmission lines (TFMS and CPW) and SIW, mostly with infinite ground/cavity width, were reported [27,29].…”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

Advanced multilayer thick‐film technology and TFMS, CPW, and SIW up to 180 GHz for cost‐effective ceramic‐based circuits and modules

Samanta¹

2018

IET Microwaves, Antennas & Propagation

Self Cite

View full text Add to dashboard Cite

This study presents the design, accurate characterisation, and performance comparison for multilayer thin‐film microstrip (TFMS), coplanar waveguide (CPW), and substrate integrated waveguides (SIW) lines and interconnects for various transverse dimensions, which are fabricated on thin dielectric layers, using advanced ceramic‐based photoimageable thick‐film technology. The influence of ground‐plane width on multilayer finite‐ground planar transmission lines (TFMS and CPW) and the influence of cavity dimensions on SIW have been experimentally studied. This includes the variation of characteristic impedance and attenuation with normalised ground‐/cavity‐width and extending frequency to beyond 110 GHz (180 GHz, for SIW). Contrary to conventional fence‐post, metal‐filled trenches have been used for SIW, showing high performance (loss of 0.2 dB/mm at 110 GHz, even for a thin dielectric) and suitable for operation beyond 180 GHz, the highest frequency reported for off‐chip integration in MCMs. Further, for the first time, comprehensive comparative performances of traditional microstrip, TFMS, CPW, and SIW, in circuit/system design perspective, have been presented for enabling proper selection of transmission media and interconnect with optimum transverse/ground width, and development of compact and high performance millimetre‐wave multichip module front‐ends economically.

show abstract

Section: Siw Up To 180 Ghz In Advanced Multilayer Thickfilm Technologysupporting

confidence: 82%

Section: Some Of the Special Process Capabilitiesmentioning

confidence: 99%

Section: Siw Up To 180 Ghz In Advanced Multilayer Thickfilm Technologymentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Advanced multilayer thick‐film technology and TFMS, CPW, and SIW up to 180 GHz for cost‐effective ceramic‐based circuits and modules

Samanta¹

2018

IET Microwaves, Antennas & Propagation

Self Cite

View full text Add to dashboard Cite

show abstract

A W‐band air‐filled coaxial bandpass filter employing micro metal additive manufacturing technology

Shi

et al. 2021

Int J RF Microw Comput Aided Eng

View full text Add to dashboard Cite

This article presents a W-band air-filled coaxial bandpass filter with multiple transmission zeros using micro metal additive manufacturing technology. The coaxial structure was fabricated through the electroforming of thick copper layer by layer and inner conductor of coax is supported by SU-8 photo-resist. The internal cross-section size of the coaxial lines is 0.3 mm Â 0.3 mm, which is very compact. The filter is composed of five paralleled dual-behavior resonators (DBRs), four transformers and a pair of coax-to-CPW (Co-plane waveguide) transitions to facilitate the measurement. The relative bandwidth in a wide range can be realized by manipulating the location of the connection points among the resonators and the transformers instead of changing the characteristic impedance of the transformers. Hence, the extreme width of coaxial line and dimensional discontinuities can be avoided to facilitate the fabrication. To validate the filtering design and the manufacturing technology, a fifth order bandpass filter prototype with center frequency 96 GHz, bandwidth of 8 GHz was designed and fabricated. The complete fabrication process was also given in detail. The measured results are in good agreement with simulation: overall insertion loss (IL) of 2.05 dB, 7.95 GHz bandwidth and return loss better than 15 dB in passband. In addition, the influence of processing technology on IL is also discussed, showing that this technology can achieve excellent surface finish and the impact of non-zero surface roughness filtering IL is insignificant. K E Y W O R D Sair-filled coaxial TL, bandpass filter, micro metal additive manufacturing | INTRODUCTIONMillimeter wave (MMW) devices are now widely used in communication and radar systems. Lightweight, a high level of integration and miniaturization are some of the main requirements of the MMW devices. Traditional MMW devices are usually implemented based on CNC milled waveguides, however, the package used in practice is large. 1 Therefore, the bulky dimensions and weight impede the integration and miniaturization of the whole system. Also, when the frequency increases, the fabrication cost also increases a lot. In recent years, some other Zixian Wu and Guanghua Shi are Co-first authors.

show abstract

Thermal Characteristics of Vertically-Integrated GaN/SiC-on-Si Assemblies: A Comparative Study

Rasilainen

Ingelhag

Melin

et al. 2019

2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

View full text Add to dashboard Cite

Surfing the Millimeter-Wave: Multilayer Photoimageable Technology for High Performance SoP Components in Systems at Millimeter-Wave and Beyond

Cited by 14 publications

References 48 publications

Advanced multilayer thick‐film technology and TFMS, CPW, and SIW up to 180 GHz for cost‐effective ceramic‐based circuits and modules

Advanced multilayer thick‐film technology and TFMS, CPW, and SIW up to 180 GHz for cost‐effective ceramic‐based circuits and modules

A W‐band air‐filled coaxial bandpass filter employing micro metal additive manufacturing technology

Thermal Characteristics of Vertically-Integrated GaN/SiC-on-Si Assemblies: A Comparative Study

Contact Info

Product

Resources

About