Synchronously improved electromagnetic interference shielding and thermal conductivity for epoxy nanocomposites by constructing 3D copper nanowires/thermally annealed graphene aerogel framework
“…38 The second step of the thermal degradation was caused by the urethane bond in WPU, and the third step was caused by the thermal decomposition of the so segments and cyclotriphosphazene moieties. 36 Compared to the other two types of WPU, the FR-WPU/HEPCP5 had a higher T max ranging 335-390 C. The degradation temperature T max2 of FR-WPU/HEPCP5 was similar to the T max1 of pure WPU, though the T max3 of FR-WPU/HEPCP5 was signicantly increased. This could be due to the thermally induced crosslinking action caused by the azomethine double bond in HEPCP, which could delay the decomposition of WPU.…”
Section: Thermal Propertiesmentioning
confidence: 87%
“…5 and Table 2. The temperature at a weight loss of 5% (T d5% ), the temperature at the maximum decomposition rate (T max ), the residual at 600 C and the calculated heat-resistance index (T HRI ) 36 are summarised in Table 2. As can be seen from Table 2, there are no signicant changes of T 5% , the T HRI and residual char remaining at 600 C increased signicantly.…”
A novel reactive intumescent fire retardant hexa-[4-[(2-hydroxy-ethylimino)-methyl]-phenoxyl]-cyclotriphosphazene (HEPCP), containing both cyclotriphosphazene and Schiff base structures, is successfully prepared.
“…38 The second step of the thermal degradation was caused by the urethane bond in WPU, and the third step was caused by the thermal decomposition of the so segments and cyclotriphosphazene moieties. 36 Compared to the other two types of WPU, the FR-WPU/HEPCP5 had a higher T max ranging 335-390 C. The degradation temperature T max2 of FR-WPU/HEPCP5 was similar to the T max1 of pure WPU, though the T max3 of FR-WPU/HEPCP5 was signicantly increased. This could be due to the thermally induced crosslinking action caused by the azomethine double bond in HEPCP, which could delay the decomposition of WPU.…”
Section: Thermal Propertiesmentioning
confidence: 87%
“…5 and Table 2. The temperature at a weight loss of 5% (T d5% ), the temperature at the maximum decomposition rate (T max ), the residual at 600 C and the calculated heat-resistance index (T HRI ) 36 are summarised in Table 2. As can be seen from Table 2, there are no signicant changes of T 5% , the T HRI and residual char remaining at 600 C increased signicantly.…”
A novel reactive intumescent fire retardant hexa-[4-[(2-hydroxy-ethylimino)-methyl]-phenoxyl]-cyclotriphosphazene (HEPCP), containing both cyclotriphosphazene and Schiff base structures, is successfully prepared.
“…The combination of different materials is used to create different structural features with enhanced EMI shielding. [17][18][19][20][21][22][23][24][25][26][27][28] Absorption, reection, and multiple reections are central factors for the EMI shielding behaviour of materials, where one aspect of the basic mechanism is more dominant than others. Absorption can be enhanced by increasing the bipolarity of the composite, whereas reection depends on the electric conductivity of the materials.…”
Section: Introductionmentioning
confidence: 99%
“…PEDOT : PSS/waterborne polyurethane (WPU) composite exhibits EMI shielding of 62 dB with 0.15 mm. [24][25][26][27][28] Therefore, increasing thickness of the conductive polymer composites reduces the EMI shielding. Hence, conductive polymer composition should be a thin lm.…”
Section: Introductionmentioning
confidence: 99%
“…The graphene/copper nanowire embedded graphene aerogel exhibits 47 dB of EMI SE with 0.2 cm of thickness and EC of 1.208 S cm À1 . 26 The MXene polypyrrole (PPy) textile with thickness 1.3 mm (3 times coated) displays EMI SE of 90 dB with 10 S cm À1 of EC whereas Ti 3 C 2 T x /poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT : PSS) (7 : 1) with 11.1 mm thickness and 340.5 S cm À1 of EC shows 42.1 dB of EMI SE. 12,13 Hence, the MXene is a good choice for EMI shielding compare to the other llers which is due to the MXene have low density, high electric conductivity, high EMI shielding with micron thickness.…”
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