2021
DOI: 10.1149/2162-8777/ac305a
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Synergistic Effect of Fand Persulfate in Efficient Titanium Alloy Chemical Mechanical Polishing

Abstract: Titanium alloys require excellent surface quality to achieve superior performance in biomedicine. In this paper, chemical mechanical polishing (CMP) was employed to prepare a satisfactory TC4 alloy surface. F− and persulfate were used as critical additives to improve the CMP efficiency. In comparison with the basic slurry without F− and persulfate, the slurry containing only F−, and the slurry containing only persulfate, the slurries containing both F− and persulfate lead to a noticeable increase in the materi… Show more

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Cited by 7 publications
(2 citation statements)
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References 45 publications
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“…The number of abrasive particles involved in polishing is increased correspondingly with the decrease of abrasive size under the same mass fraction. However, the research [27][28][29] shows that the peak viscosity of the STP slurry decreases with the decrease of abrasive size, and the removal efficiency of polishing slurry decreases accordingly. It explains why S/N ratio of surface roughness (S a ) exhibits an initial increase followed by a decrease with the increase in abrasive particle size, while S/N ratio of MRR shows an increase with the increase in abrasive particle size.…”
Section: Influence Of Abrasive Particle Sizementioning
confidence: 99%
“…The number of abrasive particles involved in polishing is increased correspondingly with the decrease of abrasive size under the same mass fraction. However, the research [27][28][29] shows that the peak viscosity of the STP slurry decreases with the decrease of abrasive size, and the removal efficiency of polishing slurry decreases accordingly. It explains why S/N ratio of surface roughness (S a ) exhibits an initial increase followed by a decrease with the increase in abrasive particle size, while S/N ratio of MRR shows an increase with the increase in abrasive particle size.…”
Section: Influence Of Abrasive Particle Sizementioning
confidence: 99%
“…8 Chemical mechanical polishing (CMP) is an ultra-precision machining technology that combines mechanical grinding and chemical corrosion. [9][10][11] The polishing slurry is a crucial part of CMP, containing abrasives, chemicals, and so on. 12,13 Among them, nanodiamond (ND) abrasives are characterized by ultra-hardness and large specific surface area, which brings to outstanding mechanical polishing effect and high material removal rate.…”
mentioning
confidence: 99%