Synergistic Effect of Glycine and BTA on Step Height Reduction Efficiency after Copper CMP in Weakly Alkaline Slurry

Cao, Yan; Liu, Yuling; Zhang, Jin; Wang, Chenwei; Zhang, Wenxia; He, Ping; Pan, Guofeng

doi:10.1149/2.0291612jss

Cited by 33 publications

(17 citation statements)

References 37 publications

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“…Benzotriazole (BTA, C 6 H 5 N 3 ) is an effective and most widely used inhibitor by adsorbing and forming a compact polymer complex on metal especially on copper surface. [16][17][18][19][20][21] However, BTA is toxic and slightly soluble in water and the chemisorbed BTA molecules film removal needs strong mechanical force, which may cause severe damage to the fragile copper damascene structure. 22 Hence some other environment-friendly inhibitors have been researched and introduced to slurry.…”

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confidence: 99%

Role of 1,2,4-Triazole in Co/Cu Removal Rate Selectivity and Galvanic Corrosion during Barrier CMP

Zhang

Liu

Wang

et al. 2017

ECS J. Solid State Sci. Technol.

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Removal rate selectivity control and galvanic corrosion reduction between cobalt (Co) and copper (Cu) are two challenges during cobalt barrier chemical mechanical polishing process in copper interconnects. This paper focuses on the investigation of a typical inhibitor 1,2,4-triazole on Co/Cu removal rate selectivity and galvanic corrosion under alkaline conditions. It is revealed that the selectivity of cobalt removal to copper is improved by accelerating the cobalt removal at low 1,2,4-triazole concentration, and then the removal rate of both metals is inhibited as 1,2,4-triazole further increased at 0.5 wt% colloidal silica concentration. Based on results, the inhibition action of 1,2,4-triazole was proposed. 1,2,4-TAH and 1,2,4-TA − species exist and account for at pH 10, then physical adsorption between 1,2,4-TAH and copper or cobalt atom via N4 site and chemical adsorption between 1,2,4-TA − and metal cation by sharing nitrogen atoms with a free electron pair in triazole ring occur on the two metals surface, resulting in copper and cobalt inhibited. The corrosion inhibition efficiency (IE) and corrosion potential difference ( E) was obtained from the potentiodynamic polarization plots. The results indicate that 1,2,4-triazole is an effective inhibitor both for chemical and galvanic corrosion.

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confidence: 99%

Role of 1,2,4-Triazole in Co/Cu Removal Rate Selectivity and Galvanic Corrosion during Barrier CMP

Zhang

Liu

Wang

et al. 2017

ECS J. Solid State Sci. Technol.

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“…From Table II, it can be seen that higher solubility of TAZ is beneficial for the preparation of commercially used Cu slurries. 6,7 The XPS Cu2p 3/2 spectra immersed into Ref (0.5 wt% SiO 2 + 2 wt% Glycine + 0.3 wt% H 2 O 2 + 5 ml FAOA) with the absence and the presence of inhibitor TAZ is shown in Fig. 6.…”

Section: Resultsmentioning

confidence: 99%

“…There is a stable current in a range of potentials, proving that the effect of the corrosion inhibition of Cu is related to the formation of a protective thin film. The main cathodic reactions in the solution with H 2 O 2 are as follows [7][8][9] :…”

Section: Resultsmentioning

confidence: 99%

“…The surface of the Cu electrode generates Cu oxide, and then forms the cupric hydroxide, which can be hydrolyzed to yield a small amount of Cu ions, thereby making the chemical reaction intense. 7 With the adding of inhibitor ADS, surfactant molecular preferentially adsorbs on the Cu surface and a increases continuously. Such result is consistent with the above electrochemical experiments.…”

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confidence: 99%

“…4,5 As is well known, inhibitors have been used to protect the concave of Cu surface from chemical dissolution, while the convex regions are selectively flattened by both mechanical polishing and chemical dissolution, so that global planarization and satisfactory Cu surface quality can be realized. 6,7 Surface reactions of these individual chemicals often change significantly in the presence of other co-additives in the slurry. 4,8 Thus, the combined performance of the chemical mixture is more important than those of the individual additives, which can not only reduce the use of additives, but also achieve better polishing properties.…”

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Synergistic Action Mechanism and Effect of Ammonium Dodecyl Sulfate and 1,2,4-triazole in Alkaline Slurry on Step Height Reduction for Cu CMP

Yang

Niu

Zhou

et al. 2020

ECS J. Solid State Sci. Technol.

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For the copper (Cu) chemical mechanical polishing (CMP) of integrated circuit Cu wiring, the removal rate (RR) in the concave is lower because of the protecting of inhibitor in the slurry, and the step height is reduced by the high RR different between convex and concave, thus realizing planarization. With the decrease of technology node and the shortcomings of traditional inhibitors, new environmental inhibitors have become the focus of research. The synergistic inhibiting effect of ammonium dodecyl sulfate (ADS) and 1,2,4-triazole (TAZ) in the H2O2 based weakly alkaline slurry during the Cu film CMP process was studied. Electrochemistry, X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM) measurements were used to analyze the reaction mechanism between Cu and mixed inhibitors. It was found that ADS was absorbed on the Cu surface via electrostatic interactions, by which a thin porous film with small openings was formed. Then chemisorbed TAZ molecules effectively filled up the small openings, and a compact passivating film was formed to protect the Cu surface. Based on the background slurry, incorporation of 0.1 wt% ADS + 0.003 wt% TAZ (bulk) and 0.1 wt% ADS + 0.005 wt% TAZ (soft landing) at pH = 8.5 in this slurry, lower step height was achieved dropping from the initial 3800 Å to 654 Å, and the slurry can be stable for at least three days. Such results indicate that mixed inhibitors may become a trend of industrial application, and such research has certain guiding significance for industrial production.

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Toward Understanding the Adsorption And Inhibition Mechanism of Cu-MBTA Passivation Film on Copper Surface: A Combined Experimental and DFT Investigation

Liu

Yin

Tan

et al. 2020

Electron. Mater. Lett.

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Synergistic Effect of Glycine and BTA on Step Height Reduction Efficiency after Copper CMP in Weakly Alkaline Slurry

Cited by 33 publications

References 37 publications

Role of 1,2,4-Triazole in Co/Cu Removal Rate Selectivity and Galvanic Corrosion during Barrier CMP

Role of 1,2,4-Triazole in Co/Cu Removal Rate Selectivity and Galvanic Corrosion during Barrier CMP

Synergistic Action Mechanism and Effect of Ammonium Dodecyl Sulfate and 1,2,4-triazole in Alkaline Slurry on Step Height Reduction for Cu CMP

Toward Understanding the Adsorption And Inhibition Mechanism of Cu-MBTA Passivation Film on Copper Surface: A Combined Experimental and DFT Investigation

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