Abstract:Decoupling the key interfacial mechanisms (chemical and mechanical) present during Cu CMP is critical to the development of slurry/pad consumable sets to reduce defectivity at advanced technology nodes. Understanding the Prestonian relationship, or lack thereof, can give rise to correlations between film density as a result of passivation film kinetics and thermodynamics as they relate to Cu oxidation/electrochemistry under dynamic conditions. The efficiency of film removability is strongly correlated to the m… Show more
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