Synergistic effect of spherical Al 2 O 3 particles and BN nanoplates on the thermal transport properties of polymer composites

Kim, Young-Kuk; Chung, Jae-Yong; Jung, Jae‐Yong; Baek, Youn-Kyung; Shin, Pyoung-Woo

doi:10.1016/j.compositesa.2017.03.030

Cited by 94 publications

(43 citation statements)

References 32 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Isolated particles in the matrix have low or no effect in thermal transfer characteristics of composites. In such cases, the conductive network can be formed by the incorporation of nano particles; these nano particles act as a bridging or gap filling agents . In order to form the conductive network and achieve high “K” of composites, Y.K.…”

Section: Role and Effect Of Filler/hybrid Filler Addition On Thermal mentioning

confidence: 99%

“…In such cases, the conductive network can be formed by the incorporation of nano particles; these nano particles act as a bridging or gap filling agents. 36,38 In order to form the conductive network and achieve high "K" of composites, Y.K. Kim et al 36 utilized the synergistic effect of multicomponent fillers containing spherical alumina and BN nanoparticles, and small amount of silica were added with the matrix.…”

Section: Role and Effect Of Filler/hybrid Filler Addition On Thermamentioning

confidence: 99%

See 1 more Smart Citation

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Balasubramanian

Ramesh²

2018

Polymers for Advanced Techs

153

View full text Add to dashboard Cite

Ever since the discovery of polymer composites, its potential has been anticipated for numerous applications in various fields such as microelectronics, automobiles, and industrial applications. In this paper, we review filler reinforced polymer composites for its enormous potential in microelectronic applications. The interface and compatibility between matrix and filler have a significant role in property alteration of a polymer nanocomposites. Ceramic reinforced polymeric nanocomposites are promising candidate dielectric materials for several micro‐ and nano‐electronic devices. Because of its synergistic effect like high thermal conductivity, low thermal expansion, and dielectric constant of ceramic fillers with the polymer matrix, the resultant nanocomposites have high dielectric breakdown strength. The thermal and dielectric properties are discussed in the view of filler alignment techniques and its effect on the composites. Furthermore, the effect of various surface modified filler materials in polymer matrix, concepts of network forming using filler, and benefits of filler alignment are also discussed in this work. As a whole, this review article addresses the overall view to novice researchers on various properties such as thermal and dielectric properties of polymer matrix composites and direction for future research to be carried out.

show abstract

Section: Role and Effect Of Filler/hybrid Filler Addition On Thermal mentioning

confidence: 99%

Section: Role and Effect Of Filler/hybrid Filler Addition On Thermamentioning

confidence: 99%

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Balasubramanian

Ramesh²

2018

Polymers for Advanced Techs

153

View full text Add to dashboard Cite

show abstract

“…Namely, incremental increases in the temperature of the main board and inside the chassis caused by the high‐temperature elements lead to a reduction in the lifetimes of other elements in the same space as well as the high‐temperature element itself. Therefore, prompt heat release from the high‐temperature element is a necessity, and the polymer materials such as thermal interface material (TIM) that are often used for electronic components are required to possess high levels of thermal conductivity (TC) . As polymers generally show low levels of TC, their apparent TC is often increased via the addition of fillers with high TC.…”

Section: Introductionmentioning

confidence: 99%

Effective thermal conductivity for nanocarbon/polyimide and carbon nanofiber/hexagonal boron nitride/polyimide composites

et al. 2018

View full text Add to dashboard Cite

Effective thermal conductivity (TC) was experimentally measured for single‐walled carbon nanotube (SWCNT)/polyimide (PI) composites with a filler content up to 8 vol% and for carbon nanofiber (CNF)/PI composites with a filler content up to 24 vol%. The measurement results indicated that the values for effective TC for SWCNT/PI and CNF/PI composites were similar up to a filler content of 8 vol%. The experimental results were then correlated via thermal conductive models proposed by Xue and by Hamilton and Crosser, and reasonable correlation results were obtained for both the SWCNT/PI and CNF/PI composite sheets. The Nielsen model capably reproduced the experimental TC values without parameter‐fitting operations. Moreover, correlations using the effective medium approach (EMA) were also performed by adjusting the interfacial resistance. Good correlation results were obtained for both the SWCNT/PI and CNF/PI composites, and the correlated interfacial resistance showed reasonable values that compared to those found in the literature. Furthermore, the effect that the coadditions of CNF and hexagonal boron nitride (hBN) exerted on the effective TC of PI was investigated for a wide range of ratios of CNF to hBN. A small amount of CNF significantly increased the effective TC of CNF/hBN/PI composites. POLYM. COMPOS., 40:3032–3039, 2019. © 2018 Society of Plastics Engineers

show abstract

“…ceramic fillers, spherical Al 2 O 3 has often been used as electronic packaging materials because it exhibits higher thermal conductivity (32 W/m K), easier surface modification, wider source, higher load, lower viscosity, better fluidity, and excellent insulation performance [19,20]. Alumina as a thermal conductivity filler to enhance the thermal conductivity of polymers has been widely examined by many researchers [21][22][23].In general, the high thermal conductivity of polymer composites mainly depends on whether the filler has a good thermal conduction path or network, which is mainly related to the interfacial interaction and dispersion of the filler in polymers matrix [7,[24][25][26]. Generally speaking, poor interface combination between a thermal conductivity filler and polymer matrix leads to poor dispersion of the filler.…”

mentioning

confidence: 99%

mentioning

confidence: 99%

Polydopamine-Modified Al2O3/Polyurethane Composites with Largely Improved Thermal and Mechanical Properties

et al. 2020

Materials

View full text Add to dashboard Cite

Alumina/polyurethane composites were prepared via in situ polymerization and used as thermal interface materials (TIMs). The surface of alumina particles was modified using polydopamine (PDA) and then evaluated via Fourier transform infrared spectroscopy (FTIR), thermogravimetric analysis (TG), and Raman spectroscopy (Raman). Scanning electron microscope (SEM) images showed that PDA-Al 2 O 3 has better dispersion in a polyurethane (PU) matrix than Al 2 O 3 . Compared with pure PU, the 30 wt% PDA-Al 2 O 3 /PU had 95% more Young's modulus, 128% more tensile strength, and 76% more elongation at break than the pure PU. Dynamic mechanical analysis (DMA) results showed that the storage modulus of the 30 wt% PDA-Al 2 O 3 /PU composite improved, and the glass transition temperature (Tg) shifted to higher temperatures. The thermal conductivity of the 30 wt% PDA-Al 2 O 3 /PU composite increased by 138%. Therefore, the results showed that the prepared PDA-coated alumina can simultaneously improve both the mechanical properties and thermal conductivity of PU. ceramic fillers, spherical Al 2 O 3 has often been used as electronic packaging materials because it exhibits higher thermal conductivity (32 W/m K), easier surface modification, wider source, higher load, lower viscosity, better fluidity, and excellent insulation performance [19,20]. Alumina as a thermal conductivity filler to enhance the thermal conductivity of polymers has been widely examined by many researchers [21][22][23].In general, the high thermal conductivity of polymer composites mainly depends on whether the filler has a good thermal conduction path or network, which is mainly related to the interfacial interaction and dispersion of the filler in polymers matrix [7,[24][25][26]. Generally speaking, poor interface combination between a thermal conductivity filler and polymer matrix leads to poor dispersion of the filler. These all cause strong phonon scattering and reduce phonon transmission efficiency, and then lead to the poor thermal conductivity of the interface [12,18,20,27,28]. It is reported that surface modification and functionalization of the filler can improve compatibility with the polymer matrix [29,30]. Common surface modification methods are hydroxylation [31], surfactant [32], coupling agent [27,33], etc. In recent years, bio-activated modification of polydopamine has become popular as a simple, environmentally-friendly, and efficient method. Polydopamine (PDA) is easy to adhere to the surface of inorganic and organic materials, and the abundant phenolic hydroxyl groups on the surface of polydopamine are conducive to the formation of stronger interaction with the resin matrix [9,13,17,34]. In this study, the surface of spherical Al 2 O 3 was modified using polydopamine as a modifier. In order to realize insulating composites with high thermal conductivity and mechanical properties, a high load of spherical Al 2 O 3 particles are required. However, if the filler cannot be uniformly dispersed in the matrix and has good compatibility with the ma...

show abstract

Synergistic effect of spherical Al 2 O 3 particles and BN nanoplates on the thermal transport properties of polymer composites

Cited by 94 publications

References 32 publications

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Effective thermal conductivity for nanocarbon/polyimide and carbon nanofiber/hexagonal boron nitride/polyimide composites

Polydopamine-Modified Al2O3/Polyurethane Composites with Largely Improved Thermal and Mechanical Properties

Contact Info

Product

Resources

About