2024
DOI: 10.1021/acsapm.4c01854
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Synergistic Enhancement of Mechanical and Dielectric Properties in Transparent Polyimides by Regulating Hydrogen Bonding and Microbranched Cross-Linking Structure

Yulin Li,
Jianqiao Zhao,
Fen Zhao
et al.

Abstract: The development of polyimide (PI) films with excellent mechanical properties and low dielectric constants is crucial for flexible optoelectronic devices and printed circuit boards. Here, a method to improve the mechanical properties and decrease the dielectric constant of PI films is reported by introducing a synergistic effect between hydrogen bonding (H-bonding) and microbranched cross-linking structures. A triamine monomer (4,4′,4″-(1H-imidazole-2,4,5-triyl) trianiline, DTI) acting as a hydrogen bond donor … Show more

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