Synthesis and Characterization of Aromatic–Aliphatic Polyamide Nanocomposite Films Incorporating a Thermally Stable Organoclay

Abstract

Nanocomposites were synthesized from reactive thermally stable montmorillonite and aromatic–aliphatic polyamide obtained from 4-aminophenyl sulfone and sebacoyl chloride. Carbonyl chloride terminal chain ends were generated using 1% extra sebacoyl chloride that could interact chemically with the organoclay. The distribution of clay in the nanocomposites was investigated by XRD, SEM, and TEM. Mechanical and thermal properties of these materials were monitored using tensile testing, TGA, and DSC. The results revealed delaminated and intercalated nanostructures leading to improved tensile strength and modulus up to 6 wt% addition of organoclay. The elongation at break and toughness of the nanocomposites decreased with increasing clay contents. The nanocomposites were thermally stable in the range 400–450 °C. The glass transition temperature increased relative to the neat polyamide due to the interfacial interactions between the two phases. Water uptake of the hybrids decreased upon the addition of organoclay depicting reduced permeability.

Incorporation of palladium nanoparticles into aromatic polyamide/clay nanocomposites through facile dry route

“…The unique combinations of properties, which are not fea sible with traditional fillers can be achieved through this route including reduced permeability, optical clar ity, self passivation, flammability, oxidation and abla tion resistance. The morphology of polymer clay nanocomposites immiscible [5][6][7], intercalated [5,[7][8][9][10][11][12], partially exfoliated [8,9,[12][13][14] or exfoliated [6,14,15] depends on the clay content, chemical nature of the organic modifier and the synthetic method [16]. An exfoliated system is more feasible with lower clay content (1 to 4 wt %) and an intercalated structure is frequently observed for nanocomposites with higher clay content [12,16].…”

Obtaining Technology for Nanocomposites Based on Polyamide-6 and Organomodified Montmorillonite

“…Journal of Chemistry and Technologies, 2018, 26(1), [9][10][11][12][13][14][15][16][17][18][19] Moisture removal from polyamide-6 is carried out by drying at 60 °С during 4 hours. Then modified montmorillonite is mechanically inmixed with polymer.…”

Preparation and Characterization of Transparent Polyimide–Silica Composite Films Using Polyimide with Carboxylic Acid Groups

“…To serve as flexible organic electronic device substrates, polymer materials should possess high gas barriers, flexibility, toughness, processability, thermal stability and chemical resistance [1,2,3]. Of the many available organic polymer materials, polyimides (PIs) have been widely used in the electronic device industry due to their excellent thermal properties, such as heat resistance, high thermal degradation temperature and high glass transition temperature, as well as their electrical and mechanical properties [4,5,6,7,8]. However, the optical properties of PI films have some disadvantages, such as low transmittance and a deep yellowish color, due to strong intermolecular interactions through pi–pi interactions and charge-transfer complex formation arising from the use of dianhydride and diamine monomers for polymerization [9,10].…”