Synthesis and characterization of copper, polyimide and TIPS-pentacene layers for the development of a solution processed fibrous transistor

Abstract

A study was performed for the development of a flexible organic field effect transistor starting from a polyester fibre as substrate material. Focus of subsequent layer deposition was on low temperature soluble processes to allow upscaling. Gate layer consists out of a pyrrole polymerization and copper coating step. Polyimide dielectric layer was deposited using dipcoating. Gold electrodes were vacuum evaporated and patterned via mask fibre shadowing. The active layer consisted of a soluble p-type TIPS-pentacene organic semiconductor. Different deposition techniques have been examined. Considerable progress in development of a transistor has been made

Synthesis and Characterization of Organosoluble, Thermal Stable and Hydrophobic Polyimides Derived from 4-(4-(1-pyrrolidinyl)phenyl)-2,6-bis(4-(4-aminophenoxy)phenyl)pyridine

“…For example, poor solubility in most organic solvents, high softening and meting temperatures, and deeply color that often limit their widespread application in various advanced technologies [13,14,15,16,17,18,19]. Thus, many efforts have been devoted to improving the solubility, processability, and highly optical transparent of PIs by the incorporation of flexible or twist linkages [20,21,22,23], asymmetric noncoplanar units [24,25,26], bulky pendant groups [27,28,29], and fluorinated substituents [30,31,32,33,34] into the polymer backbones.…”

Surface Morphology of Polyimide Thin Film Dip-Coated on Polyester Filament for Dielectric Layer in Fibrous Organic Field Effect Transistor

“…Previous research [2] confi rmed this phenomenon that minimal speed at which an insulating coating is obtained decreases with increasing solution concentration. In view of the fi nal application as OFET, deposition of the contacts serving as source and drain electrodes is of importance with regard to dimensions.…”

“…One of the reasons for this might be that realization of reliable conductive fi laments, coated by electroless copper plating, has not been achieved in the past [3]. Nowadays, we are able to successfully reproduce conductive copper-coated polyester fi laments with a diameter of 888 µm [2], which enables us to further engage with this research. Using a copper-coated PES fi lament in comparison to a copper wire has the advantage that the fi lament is not reluctant to break, it is fl exible and therefore is the better choice when thinking about, e.g.…”

“…The PES fi lament was purchased from Teijin, whereas the copper coating was applied on its surface as described by Van Genabet et al [21].…”

“…Material science as well as physics and chemistry have an undeniable impact. Besides academia, also industry research strives for making truly integrated textile electronics [1][2][3].…”