2014
DOI: 10.1002/pola.27445
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Synthesis and characterization of high nitrile content polyimides as dielectric films for electrical energy storage

Abstract: Three new isomeric diamines containing three, oxylinked benzonitriles (3BCN), one of which is asymmetric (meta, para, or m, p), are synthesized in a 3-step sequence. Polycondensation of these diamines and four common dianhydrides (6FDA, OPDA, BTDA, and PMDA) in N,N-dimethylacetamide via poly(amic acid) precursors and thermal curing at temperatures up to 300 C lead to three series of tough, creasable polyimide (PI) films (tensile moduli 5 1.63 2 2.86 GPa). Among these PIs, two PMDA-based PIs possess relatively… Show more

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Cited by 90 publications
(63 citation statements)
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“…This brings extra weight, volume and energy consumption to the integrated power system and reduces its reliability and efficiency. The upsurge in lightweight and flexible electronic devices has also created a tremendous demand for high-temperature dielectric polymers, as the heat generated by electronic devices and circuitry increases exponentially with miniaturization and functionality.A variety of high-performance engineering polymers have been considered as possible high-temperature dielectric materials to address these urgent needs [15][16][17][18][19] . Until now, the key criteria established for evaluating high-temperature dielectric polymers has been the glass transition temperature (T g ) and thermal stability.…”
mentioning
confidence: 99%
See 1 more Smart Citation
“…This brings extra weight, volume and energy consumption to the integrated power system and reduces its reliability and efficiency. The upsurge in lightweight and flexible electronic devices has also created a tremendous demand for high-temperature dielectric polymers, as the heat generated by electronic devices and circuitry increases exponentially with miniaturization and functionality.A variety of high-performance engineering polymers have been considered as possible high-temperature dielectric materials to address these urgent needs [15][16][17][18][19] . Until now, the key criteria established for evaluating high-temperature dielectric polymers has been the glass transition temperature (T g ) and thermal stability.…”
mentioning
confidence: 99%
“…A variety of high-performance engineering polymers have been considered as possible high-temperature dielectric materials to address these urgent needs [15][16][17][18][19] . Until now, the key criteria established for evaluating high-temperature dielectric polymers has been the glass transition temperature (T g ) and thermal stability.…”
mentioning
confidence: 99%
“…1B). It is important to note that the low-field room temperature dielectric loss is drastically different from the loss shown at high electric fields and elevated temperatures because of the nonlinear conduction related to charge injection and leakage current (20)(21)(22)(23). Indeed, at 150°C and 200 MV m −1 , the dielectric loss rises rapidly from 18% of the pristine c-BCB to more than 47% of c-BCB/BT as determined from the electric displacementelectric field (D-E) loops (Fig.…”
Section: Resultsmentioning
confidence: 99%
“…The electronic conduction has been identified as the main loss mechanism of dielectrics operating at elevated temperatures (21)(22)(23), which is responsible for a sharp increase in the dielectric loss as well as substantial reductions in U e and associated η with increasing applied fields and temperatures. Phase-field simulations have been performed to better understand the leakage current observed in the nanocomposites.…”
Section: Discussionmentioning
confidence: 99%
“…[35][36][37] An example of PI synthesis is described in Section I of the ESI. [35][36][37] An example of PI synthesis is described in Section I of the ESI.…”
Section: Pi Synthesis and Lm Preparation For Dielectric Characterizamentioning
confidence: 99%