Synthesis and characterization of novel silicon-containing aromatic bispropargyl ether resins and their composites

Li, Fangfang; Wang, Canfeng; Shen, Xuening; Huang, Farong; Du, Lei

doi:10.1038/pj.2011.39

Cited by 11 publications

(5 citation statements)

References 24 publications

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“…Figure 1 shows the 1 H-NMR (CDCl 3 ) spectra of AAA, ABA-A and ABA-O polymers and the integral areas of various resonance peaks of protons. The peak at 3.08 ppm (d) can be attributed to the proton on the external acetylene group –C≡CH [ 29 ]. The peaks at 6.86–7.68 ppm can be attributed to the aromatic protons.…”

Section: Resultsmentioning

confidence: 99%

Synthesis and Characterization of Block Copolymers of Poly(silylene diethynylbenzen) and Poly(silylene dipropargyl aryl ether)

Gao

Shang

et al. 2021

Polymers

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Poly(silylene diethynylbenzene)–b–poly(silylene dipropargyloxy diphenyl propane) copolymer (ABA-A), poly(silylene diethynylbenzene)–b–poly(silylene dipropargyloxy diphenyl ether) copolymer (ABA-O), and a contrast poly(silylene diethynylbenzene) with equivalent polymerization degree were synthesized through Grignard reactions. The structures and properties of the copolymers were investigated via hydrogen nuclear magnetic resonance, Fourier transform infrared spectroscopy, Haake torque rheometer, differential scanning calorimetry, dynamic mechanical analysis, thermogravimetric analysis and mechanical tests. The results show that the block copolymers possess comprehensive properties, especially good processability and good mechanical properties. The processing windows of these copolymers are wider than 58 °C. The flexural strength of the cured ABA-A copolymer reaches as high as 40.2 MPa. The degradation temperatures at 5% weight loss (Td5) of the cured copolymers in nitrogen are all above 560 °C.

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Section: Resultsmentioning

confidence: 99%

Synthesis and Characterization of Block Copolymers of Poly(silylene diethynylbenzen) and Poly(silylene dipropargyl aryl ether)

Gao

Shang

et al. 2021

Polymers

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“…4,9 To solve this problem, polar aromatic ether structures and siloxane structures were introduced into the resins to modify the toughness of the resins. [10][11][12][13][14] Huang's group prepared a series of siliconcontaining arylacetylene resins with polyphenylene oxide segments in the main chain, which show good mechanical properties. [14][15][16] With the increase of the polyphenylene oxide segments in the main chain, the mechanical properties of the resins gradually increase, but processability and heat resistance gradually deteriorate.…”

Section: Introductionmentioning

confidence: 99%

Effects of pendant side groups on the properties of the silicon-containing arylacetylene resins with 2,5-diphenyl-[1,3,4]-oxadiazole moieties

Liu

et al. 2021

RSC Adv.

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“…silicon‐containing polyarylacetylene (PSA), which exhibited relatively better heat resistance and processability than traditional polyarylacetylene resins 8–10 . Homrighausen and Keller, 11 Du and co‐workers 12,13 and other groups 14–16 have pushed this research by designing diverse chemical structures of PSA resins. However, the thermal stability and processability of PSA resins still need to be improved further for applications in aerospace and aviation areas.…”

Section: Introductionmentioning

confidence: 99%

Highly heat‐resistant branched silicon‐containing arylacetylene resins with low curing temperature

Ling

Zhu

Cai

et al. 2021

Polymer International

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Silicon‐containing arylacetylene (PSA) resins exhibit excellent thermal stability. However, the high curing temperature limits their applications. Herein, we report that changing the topology of PSA resins from linear to branched effectively decreases their curing temperature with no deterioration of thermal stability. Two sets of resins based on silyleneethynylene–naphthalene–ethynylene (SNP) and silyleneethynylene–phenyl–ethynylene (SPN) repeat units were studied. It is found that the branched resins exhibit considerably lower thermal curing temperatures than their linear counterparts. The exothermic peaks for branched SNP (BSNP) and branched SPN (BSPN) are about 190 and 214 °C, respectively, which are 18 and 25 °C lower than those for their linear counterparts (i.e. PSNP and PSPN). Density functional theory was applied to theoretically explain the differences in the thermal curing temperature between the linear and branched resins. The lower curing temperature of the branched PSAs is attributed to the greater number of terminal alkyne groups per molecule which increases the reactivity of the curing reaction to transform into a crosslinked structure. In addition, Td5 (the temperature at 5% mass loss) for BSNP and BSPN resins are 653 and 613 °C, respectively, which are comparable with those for their linear counterparts. © 2021 Society of Industrial Chemistry.

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Synthesis and characterization of novel silicon-containing aromatic bispropargyl ether resins and their composites

Cited by 11 publications

References 24 publications

Synthesis and Characterization of Block Copolymers of Poly(silylene diethynylbenzen) and Poly(silylene dipropargyl aryl ether)

Synthesis and Characterization of Block Copolymers of Poly(silylene diethynylbenzen) and Poly(silylene dipropargyl aryl ether)

Effects of pendant side groups on the properties of the silicon-containing arylacetylene resins with 2,5-diphenyl-[1,3,4]-oxadiazole moieties

Highly heat‐resistant branched silicon‐containing arylacetylene resins with low curing temperature

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