Synthesis and Characterization of Poly(dimethylsilylene ethynylenephenyleneethynylene) Terminated with Phenylacetylene

Wang, Fan; Zhang, Jian; Huang, Jianxiang; Yan, Hao; Huang, Farong; Du, Lei

doi:10.1007/s00289-005-0464-4

Cited by 68 publications

(46 citation statements)

References 19 publications

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“…[4][5][6][7][8][9][10][11][12][13] Itoh and coworkers have developed a silicon-containing polyarylacetylene. 4 The siliconcontaining polyarylacetylene, poly[(phenylsilyleneethynylene-1,3-phenyleneethynylene)] (named MSP), was synthesized by dehydrogenative coupling polymerization reactions between phenylsilane and m-diethynylbenzene.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and Properties of Arylacetylene Resins with Siloxane Units

Gao¹,

Zhang²,

Tang³

et al. 2010

Bulletin of the Korean Chemical Society

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A series of arylacetylene resins with siloxane units were synthesized by the condensation reactions of m-diethynylbenzene magnesium reagents with various α,ω-bis(chloro)dimethylsiloxanes. These resins are liquids and are miscible with common organic solvents at room temperature. The structures of the resins were characterized by FT-IR, 1 H NMR, 13 C NMR, 29 Si NMR, and gel permeation chromatography (GPC). The thermal behaviors of the resins were examined with differential scanning calorimetry (DSC). These resins have good processability. They can be thermally crosslinked through the ethynyl groups to produce cured resins. The thermal and thermooxidative stabilities of the cured resins were studied by thermogravimetric analysis (TGA). The cured resins possess high thermal and thermooxidative stability. Their decomposition occurs at above 500 o C in both N2 and air. With increasing the length of siloxane units in the resins, the thermal stability of the cured resins decreases in N2. When the cured resins were sintered above 1450 o C under argon, hard and glassy SiOC ceramics were obtained. These SiOC ceramics have the decomposition temperatures at 5% weight loss above 800 o C in air.

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Section: Introductionmentioning

confidence: 99%

Synthesis and Properties of Arylacetylene Resins with Siloxane Units

Gao¹,

Zhang²,

Tang³

et al. 2010

Bulletin of the Korean Chemical Society

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“…12,13 The silicon-containing arylacetylene polymers composed of [ASiR 2 ACBCAArACBCA] (R ¼ alkyl or phenyl) units exhibit excellent thermal stabilities after curing. [14][15][16][17] There is high content of the ethynylene group in the backbone of the polymers. Low temperature curing can be realized by 1,3-dipolar cycloaddition between ethynyl or ethynylene groups of the silicon-containing arylacetylene polymers and azide groups of azide compounds.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and characterization of a novel silicon‐containing polytriazole resin

Huang

Wan

Zhang

et al. 2009

J of Applied Polymer Sci

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4,4 0 -Diazidomethylbiphenyl (DAMBP) and poly(dimethylsilylene-ethynylenephenyleneethynylene) (PDMSEPE) were thermally polymerized to form a novel silicon-containing polytriazole resin (PDMSEPE-DAMBP) by 1,3-dipolar cycloaddition. Differential scanning calorimetry, FTIR, and 13 C-NMR were used to characterize the curing behaviors of PDMSEPE-DAMBP resins. The results indicated that the resins could cure at temperatures as low as 80C. Dynamic mechanical analysis showed that there was a glass transition at 302 C for the cured PDMSEPE-DAMBP resin. The carbon fiber (T700) reinforced PDMSEPE-DAMBP composites exhibited excellent mechanical properties at room temperature and high property retention at 250 C.

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“…The PMSEPE resin was synthesized by reference to the preparation procedure described in a published article [12]. The treated magnesium ribbons were cut into small pieces.…”

Section: Synthesis Of Poly(dimethylsilyleneethynylenephenylene Ethynymentioning

confidence: 99%

“…Recently, our laboratory has been making an effort to develop a kind of silicon-containing arylacetylene resin (SARs). The investigation on poly(dimethylsilyleneethynylene-phenyleneethynylene)s terminated with phenylacetylene was reported, which could cure at the temperature about 230°C and shows good processability and high heat resistance [12,13]. In this paper, a poly(dimethylsilyleneethynylenephenyleneethynylene) (PMSEPE) resin and fiber reinforced PMSEPE composites were prepared and characterized.…”

Section: Introductionmentioning

confidence: 99%

Fiber reinforced silicon-containing arylacetylene resin composites

Zhang¹,

Huang²,

Zhou³

et al. 2007

Express Polym. Lett.

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Abstract.A silicon-containing arylacetylene resin (SAR), a poly(dimethylsilyleneethynylene phenyleneethynylene) (PMSEPE), was synthesized. The PMSEPE is a solid resin at ambient temperature with a softening temperature about 60°C and soluble in some solvents like tetrahydrofuran. The melt viscosity of the PMSEPE resin is less than 1 Pa·s. The resin could cure at the temperature of lower than 200°C. Fiber reinforced PMSEPE composites were prepared from prepregs which were made by the impregnation of fibers in PMSEPE resin solution. The composites exhibit good mechanical properties at room temperature and 250°C. The observation on fracture surfaces of the composites reinforced by glass fibers and carbon fibers demonstrates that the adhesion between the fibers and resin is good. The results from an oxyacetylene flame test show that the composites have good ablation performance and XRD analyses indicate that SiC forms in the residues during the ablation of the composites.

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Synthesis and Characterization of Poly(dimethylsilylene ethynylenephenyleneethynylene) Terminated with Phenylacetylene

Cited by 68 publications

References 19 publications

Synthesis and Properties of Arylacetylene Resins with Siloxane Units

Synthesis and Properties of Arylacetylene Resins with Siloxane Units

Synthesis and characterization of a novel silicon‐containing polytriazole resin

Fiber reinforced silicon-containing arylacetylene resin composites

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