Synthesis and Characterization of Semicrystalline Polyimides Containing Bridged Linkages

Abstract

A series of polyimides (PI) containing bridged linkages were prepared successfully through a three-step technique. The results indicated that the glass transition temperature (T g ) of polyimides was affected by flexibility of polymer chain and the intermolecular interactions. ODPA-TPER-based polyimide possesses the lowest T g , which was 214°C. All polyimides had semicrystalline characteristics, and ODPA-TPER-based PI exhibited the lowest melting temperature (T m ) at 316°C. The polyimides had high weight loss temperatures, which indicated that bridged linkages can reduce the softening temperature, meanwhile keeping excellent thermal stability.

Polyimide Surface Modification Using He-H2O Atmospheric Pressure Plasma Jet-Discharge Power Effect

“…The widespread applications of flexible electronics has resulted in active research in the polymer-based electronics [3][4][5][6]. Polyimide is considered to be a promising flexible substrate due to its excellent optical, mechanical, thermal stability and low dielectric constant properties [7,8]. Yet, it is seldom used in its pristine form, as pristine polyimide surface is usually inert and partially hydrophobic.…”

Functionalized Multiwalled Carbon Nanotube-Reinforced Polyimide Composite Films with Enhanced Mechanical and Thermal Properties

“…Polyimide (PI) has been demonstrated one of the most important high-performance engineering plastics for its excellent mechanical property [1][2][3], thermal stability [4], and chemical resistance [5] because of its rigid-rod chemical structures, showing appealing potential in the area of electronic applications, membrane, insulating materials, and aerospace industry [6][7][8][9][10]. However, the very low thermal conductivity (0.1 W/mK) of PI can hardly meet the thermal requirements of electronic products, which limits its application in advanced microelectronics and aerospace applications.…”

Structural, Thermal, Morphological, Adsorption and Catalytic Properties of Poly(BPDAH-co-ODA/PPDA)-Ag/V2O5 Nanocomposites

“…Their thermal and mechanical properties depend on the Mw of the PI and the method adopted for its synthesis. Various diamines including phenyl derivative of ODA [14], ODA [15][16][17][18][19][20][21][22][23][24], aniline-formaldehyde resin [25], and PPDA [26,27] have been used in the polymer industry. In order to catalyse the yield and their physical, chemical, optical and mechanical properties of the nanosized materials are added as filler.…”