2012
DOI: 10.1016/j.microrel.2012.03.020
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Synthesis and characterization of sub-micron sized copper–ruthenium–tantalum composites for interconnection application

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Cited by 13 publications
(7 citation statements)
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“…Composites filled with nano‐sized filler particles have better mechanical properties in comparison to those filled with micron‐sized particles of the same filler . In recent years, sub‐micron particles have been used as fillers in composites for improving the performance of the composite materials, such as sub‐micron SiO 2 /epoxy, sub‐micron TiO 2 /poly‐ether‐ether‐ketone (PEEK), sub‐micron silica particles/epoxy, sub‐micron TiO 2 /polyethyleneterephthalate (PET), sub‐micron silica fillers/epoxy, sub‐micron sized copper/ruthenium–tantalum, and sub‐micron silica fillers/dental composite resins . The wear resistance of hybrid epoxy composites filled with submicron particles and nanoparticles (submicron‐PTFE and nano‐ZnO) was also investigated .…”
Section: Introductionmentioning
confidence: 99%
“…Composites filled with nano‐sized filler particles have better mechanical properties in comparison to those filled with micron‐sized particles of the same filler . In recent years, sub‐micron particles have been used as fillers in composites for improving the performance of the composite materials, such as sub‐micron SiO 2 /epoxy, sub‐micron TiO 2 /poly‐ether‐ether‐ketone (PEEK), sub‐micron silica particles/epoxy, sub‐micron TiO 2 /polyethyleneterephthalate (PET), sub‐micron silica fillers/epoxy, sub‐micron sized copper/ruthenium–tantalum, and sub‐micron silica fillers/dental composite resins . The wear resistance of hybrid epoxy composites filled with submicron particles and nanoparticles (submicron‐PTFE and nano‐ZnO) was also investigated .…”
Section: Introductionmentioning
confidence: 99%
“…Akbarpour et al [9] reported the microhardness value of 92.3HV for hot pressed Cu-2SiC-2CNT composites sample with relative density of above 98%. In our previous studied, we reported a hardness value of 127.8 AE 1.7 for hot pressed Cu-2.5 vol%Ru [8]. The high hardness value obtained in Cu-CNT-Ru composites sintered at 650 C could be due to good distribution of hard phase in Cu matrix follow by the spark plasma sintering.…”
Section: Influence Of Densification On Microhardness Of Sintered Matementioning
confidence: 85%
“…Ding et al [19] reported that the oxidation of Cu was inhibited to an extent with C alloying into the Ru layer. Furthermore, improved density and hardness results were obtained when increasing the Ru volume fraction in copper matrix by up to 2.5 vol% [8]. However, 1 vol% Ru decreased the electrical conductivity of pure Cu due to interfacial resistance and much higher resistivity of Ru (7.1 Â10 À6 Vcm) versus (1.68 Â 10 À6 Vcm) for copper.…”
Section: Introductionmentioning
confidence: 96%
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“…The bond coat is typically a platinium aluminide or NiAl based which provides oxidation and adhesion in the TBC System [6]. Application of TBC at elevated temperature gives rise to transfer of oxygen from the topcoat into the bond coat, so that an oxidized scale can be formed on the bond coat which is referred to as the thermally grown oxide (TGO) typically alfa-alumina [7,8].…”
Section: Introductionmentioning
confidence: 99%