Synthesis and properties of new transparent (co)polyimides based on adamantane-containing diamines and aromatic tetracarboxylic dianhydrides

Новаков, И. А.; Orlinson, B. S.; Zav’yalov, D. V.; Mednikov, S. V.; Savel’ev, E. N.; Потаенкова, Е. А.; Nakhod, M. A.; Pichugin, A. M.; Kireeva, A. V.; Kovaleva, M. N.

doi:10.1007/s11172-021-3196-1

Cited by 8 publications

(1 citation statement)

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“…However, it is worth noting that the introduction of rigid polycyclic group such as adamantane directly or as a pendent group into the polymer backbone can induce high T g and low CTE values, but the long-term heat resistance is still poor due to the nature of the alicyclic ring. [40][41][42][43][44][45][46] Thus, combining adamantane with fluorinated groups and aromatic structures is an effective way to achieve copolymerized PI (Co-PI) films with desired optical transparency, thermal stability and dimensional stability.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and characterization of adamantane-based copolyimides with high transparency

Park

et al. 2022

High Performance Polymers

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In this work, a copolyimide (Co-PI) film with high transparency was prepared by the copolymerization of hexafluoroisopropylidene)diphthalic anhydride (6FDA), 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), 2,2′-Bis(trifluoromethyl)benzidine (TFMB) and adamantane-1,3-diamine (DAA). The effects of DAA monomers on the optical, thermal, and mechanical properties of the co-PIs were discussed in detail. We found that the preparation of polyimide (PI) based on the combination of two dianhydrides and two diamines could obtain the co-PI film with excellent comprehensive performance due to the synergy between the -CF3 group, the aliphatic ring and the aromatic structure. Through the structure and composition optimization, the co-PI film with 1.30% DAA (Q3) has a Tg of 374oC, T5 higher than 530oC, T430 of 82% and the tensile strength higher than 145 MPa. These results indicate that the Co-PI films can be successfully utilized in the development of novel heat-resistant plastic substrates for the optoelectronic engineering applications.

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