Synthesis and properties of new poly(ether imides) based on pyridine‐containing aromatic dianhydride and diamine monomers

Abstract

A series of novel aromatic poly(ether imides) with inherent viscosities of 0.48-0.70 dL/g and weight-average molecular weights of 18,800-40,500 g/mol were successfully prepared from two dianhydride and two diamine monomers containing pyridine moiety via both two-step method and one-step method. Comparison of the one-step and the two-step methods for the preparation of poly(ether imides) was carried out and shown that poly (ether imides) obtained via one-step method exhibited higher molecular weights than the similar polymers prepared through two-step process. Poly(ether imide) resins obtained via both one-step and two-step methods with subsequent chemical dehydration showed good solubility not only in high boiling point solvents but also in low boiling point solvents. High-quality poly(ether imide) films could be obtained via the two-step method with subsequent thermal imidization, which exhibited excellent thermal properties with glass transition temperatures of 239-278 C, initial decomposition temperatures of 540-574 C, residual weight percent at 800 C of 64.5-69.3% under nitrogen, good thermo-oxidative stability with initial decomposition temperatures of 521-544 C, residual weight percent at 800 C of 33.6-51.1% under air atmosphere, outstanding mechanical properties with tensile strengths in the range of 104.6-109.4 MPa, tensile modulus in the range of 1.92-2.58 GPa, and elongation at break from 6.9 to 8.0%, as well as good transparency with cutoff wavelengths of 386-392 nm and low dielectric constants of 2.80-2.92 at 1 MHz.

Synthesis and Characterization of New Organosoluble and Thermally Stable Polyimides Containing Pyridine and Anthracene Units

“…The 10% decomposition temperature in air and N 2 range from 401–521 °C and the 414–531 °C respectively as evaluated by thermogravimetric analysis (Figure ). Incorporation of flexible ether and ester linkages into the main chain of aromatic polymers are expected to decrease the thermal stability of the polymers, but this can be minimized by incorporation of pyridine with heteroaromatic structure which would have excellent stabilities derived from its molecular symmetry and aromaticity …”

“…Incorporation of flexible ether and ester linkages into the main chain of aromatic polymers are expected to decrease the thermal stability of the polymers, but this can be minimized by incorporation of pyridine with heteroaromatic structure which would have excellent stabilities derived from its molecular symmetry and aromaticity. [31][32][33][34][35] T 10 values for the PI-2a-PI-3d series were slightly lower than the PI-1a-d series, possibly because of the ether and ester linkages present in the main chain of those polyimides. The char yield of polyimides is between 39.12-54.3% indicating that these polyimides have fairly high thermal stabil-ity.…”

Synthesis and characterization of new soluble polyimides based on pyridine unit with flexible linkages

“…molecular symmetry and aromaticity. 6,26 Compared with PI-2a-d series polymers, a slight decrease in thermal stability can be observed in the series of PI-1a-d. This may be due to the presence of heteroaromatic moiety in the polymer main chain itself in the former.…”

Nanocomposites of a new organosoluble polyetherimide and epoxide‐functionalized magnetite for removal of Co(II) Ions: Kinetic and thermodynamic investigations

“…For this purpose, the new aromatic dianhydride monomer, 2,6‐bis‐(isobenzofuran‐1,3‐dione‐5‐yl)pyridine (BIDP), containing pyridine a ring and ether linkages has been synthesized. Pyridine nucleolus, as a rigid symmetric aromatic ring, would contribute to the thermal and thermo‐oxidative stability, the chemical stability, and the retention of mechanical property of the resulting polymer at elevated temperature . Furthermore, the polarizability, resulting from the nitrogen atom in the pyridine ring, could be suitable to improve their solubility in polar organic solvents and lower their dielectric constant .…”