Synthesis and Properties of Pulse Electrodeposited Lead-Free Tin-Based Sn/ZrSiO4 Nanocomposite Coatings

Abstract

The Sn-based ZrSiO 4 nanocomposite coatings have been synthesized by pulse co-electrodeposition technique from an aqueous electrolyte containing SnCl 2 AE2H 2 O, C 6 H 17 N 3 O 7 , Triton X, and varying amounts of nano-sized ZrSiO 4 particles (0,5,10,15,20,25,30, and 35 g/L). As-deposited films have been analyzed using X-ray diffraction, scanning electron microscope equipped with an energy dispersive X-ray spectrometer, and transmission electron microscope. The microhardness, wear as well as corrosion property of the coatings have been also evaluated. It is observed that the surface morphology of Sn-ZrSiO 4 nanocomposite coatings is strongly dependent on the reinforcement concentration in the electrolyte, and the Sn-ZrSiO 4 nanocomposite solder deposited from the electrolyte containing 25 g/L ZrSiO 4 yields the highest hardness and the best wear and corrosion property among all the synthesized samples. The whisker growth propensity of the developed Sn-ZrSiO 4 nanocomposites has also been examined after 90 days of aging at room temperature and reported here.

High Entropy Alloy Coatings and Technology

“…The authors found a great improvement in corrosion resistance of coatings in the presence of graphene oxide which improved the homogeneity of the HEA coating matrix and prevented localized corrosion [72]. However, despite all this progress, the electroplated HEAs are still in the emerging stage, due to the complexity of processing parameters and multicomponent alloy deposition, which is a tedious task given the interrelated pulse deposition parameters [95,98,100]. Dmitry Moskovskikh et al produced (Hf 0.2 Nb 0.2 Ta 0.2 Ti 0.2 Zr 0.2 )N, which demonstrated outstanding hardness and fracture toughness (33 GPa, 5.2 MPa•m 1/2 ), compared to other reported binary and high entropy ceramics coatings [101].…”

Effect of Surface Pretreatment and Plating Time on Electromagnetic Shielding Reliability of Electroless Plated Copper Layer Conductors

“…One of the causes of peel is residual stress accumulated during plating in the Cu films. The Stoney formula was used to calculate the residual stress R S of the film: − where E s is Young’s modulus, t s and t f are the thickness of the substrate and film, r 0 and r are the radii of curvature of the substrate before and after film deposition, and v s and v f are the Poisson’s ratio of the substrate and film. The values of PET are as follow: E s = 2 GPa, t s = 1 mm, and v s = 0.43.…”

Effect of Plating Current Density on the Ball-On-Disc Wear of Sn-Plated Ni Coatings on Cu Foils

“…The formation of grooves was due to the plowing action of the indenter ball, leading to the hardening of the coating layer and further tearing by the harder WC indenter [37,38]. Additionally, at higher loads, the concentration of oxygen was prominent, which showed oxidative wear operating in a higher load regime due to the continuous increase in the rubbing of the surface by the ball indenter at higher loads [39]. A rough surface of the ball indenter showed material transfer from coatings to ball surface.…”