Synthesis and thermal properties of low melting temperature tin/indium (Sn/In) lead-free nanosolders and their melting behavior in a vapor flux

Shu, Yang; Rajathurai, Karunaharan; Gao, Fan; Cui, Qingzhou; Gu, Zhiyong

doi:10.1016/j.jallcom.2014.11.173

Cited by 35 publications

(37 citation statements)

References 30 publications

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“…The mean reflow temperature recommended for Sn-3.8Ag-0.7Cu solders is 243°C (±5°C), which is 26°C higher than its melting temperature, 3,5 in order to secure complete melting of the solder. Likewise, the reflow temperature for nanosolders was selected 26°C above their melting temperature derived from DSC measurements and verified by Eq.…”

Section: Methodsmentioning

confidence: 99%

“…This melting phenomenon under electron beam radiation was also reported in the literature. 5 The melting process of the nanoparticles was recorded on video, which was then analyzed frameby-frame. A sequence of TEM images showing the melting and coalescence of solder nanoparticles before and after purification process are shown in Figs.…”

Section: In Situ Tem Studiesmentioning

confidence: 99%

“…That makes it more difficult to optimize the reflow process for all components on the PCB. [1][2][3][4][5] To tackle this issue in the transition process toward Pb-free solders, a great many number of studies have been targeted on the synthesis of nanoparticles of pure Sn, 6 as well as near-eutectic SA 1,2 and SAC alloys 1,7,8 as promising candidates for the next generation of Pbfree solders due to their reduced melting temperatures.…”

Section: Introductionmentioning

confidence: 99%

“…Employing acidic fluxes and soaking in acidic solutions have also been sought in some studies in order to remove the oxide shell of nanosolders. 1,5,10,15 In light of the necessity to verify the reliability of the lead-free nanopowder solders, the goal of this work is to produce a prototype nano-paste by combining nanoparticle SAC solders in different size with a flux vehicle and to propose solutions for the aforementioned issues facing nanoparticle soldering.…”

Section: Introductionmentioning

confidence: 99%

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Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

Roshanghias

Khatibi

Yakymovych

et al. 2016

Journal of Elec Materi

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Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

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Section: Methodsmentioning

confidence: 99%

Section: In Situ Tem Studiesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

Roshanghias

Khatibi

Yakymovych

et al. 2016

Journal of Elec Materi

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“…Low melting temperature Sn-In solder nanoparticles were successfully synthesized through a surfactant-assisted one-step chemical reduction method [9]. Different synthesis parameters, including pH, stirring speed, and surfactant concentration, were used to control the size, shape, and uniformity of the Sn-In solder nanoparticles [9].…”

Section: Syntheses And/or Fabrications Of Low Melting Temperature Solmentioning

confidence: 99%

Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Kim¹,

Yang²

2017

Recent Progress in Soldering Materials

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The increasing application of heat-sensitive microelectronic components such as a multitude of transistors, polymer-based microchips, and so on, and flexible polymer substrates including polyethylene terephthalate (PET) and polyimide (PI), among others, for use in wearable devices has led to the development of more advanced, low melting temperature solders (<150°C) for interconnecting components in various applications. However, the current low melting temperature solders face several key challenges, which include more intermetallic compound formation (thus become more brittle), cost issues according to the addition of supplementary elements to decrease the melting point temperature, an increase in the possibility of thermal or popcorn cracking (reliability problems), and so on. Furthermore, the low melting temperature solders are still required to possess rapid electronic/electrical transport ability (high electrical conductivity and current density) and accompany strong mechanical strength sustaining the heavy-uploaded microelectronic devices on the plastic substrates, which are at least those of the conventional melting temperature solders (180-230°C). Thus, the pursuit of more advanced low melting temperature solders for interconnections is timely. This review is devoted to the research on three methods to improve the current properties (i.e., electrical and thermomechanical properties) of low melting temperature solders: (i) doping with a small amount of certain additives, (ii) alloying with a large amount of certain additives, and (iii) reinforcing with metal, carbon, or ceramic materials. In this review, we also summarize the overall recent progress in low melting temperature solders and present a critical overview of the basis of microscopic analysis with regard to grain size and solid solutions, electrical conductivity by supplementation with conductive additives, thermal behavior (melting point and melting range) according to surface oxidation and intermetallic compound formation, and various mechanical properties.

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Melting Temperature of Metallic Nanoparticles

Gao

2015

Handbook of Nanoparticles

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Melting temperature is one of the fundamental properties of materials. In principle, the melting temperature of a bulk material is not dependent on its size. However, as the size of a material decreases toward the nanometer size and approaches atomic scale, the melting temperature scales with the material dimensions. The melting temperature of a nanomaterial such as nanoparticles (isotropic) and nanorods/nanowires (anisotropic) is related to other fundamental physical properties for nanomaterial applications, including catalysts, thermal management materials, electronics materials, and energy materials.This book chapter focuses on both the theoretical and experimental studies of metallic nanoparticle melting temperature depression. Thermodynamic modeling and molecular dynamic (MD) simulations are discussed regarding the melting behavior of different nanostructures, such as spherical nanoparticles and nanowires. The currently available measurement techniques by using classical differential scanning calorimetry (DSC), recently developed nanocalorimeters, transmission electron microscope (TEM), and optical methods are introduced. In addition, the applications of metal nanoparticles with lower melting temperatures are discussed, such as nanosoldering and sintering for electronics assembly and packaging.

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Synthesis and thermal properties of low melting temperature tin/indium (Sn/In) lead-free nanosolders and their melting behavior in a vapor flux

Cited by 35 publications

References 30 publications

Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Melting Temperature of Metallic Nanoparticles

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