Synthesis, characterization, thermal properties and flame retardancy of a novel nonflammable phosphazene-based epoxy resin

Liu, Ran; Wang, Xiaodong

doi:10.1016/j.polymdegradstab.2009.01.008

Cited by 214 publications

(68 citation statements)

References 36 publications

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“…However, a few new peaks appear at 1056 cm -1 , which might be ascribed to the generation of P-O-P. Similar to the mechanism which has been reported [20,21]. The obtained structure could act as an acid catalyst, accelerating the cleavage of side groups and the breaking of ether groups in poly(phosphazene-aryl amides).…”

Section: Thermal Degradation Propertiessupporting

confidence: 78%

Synthesis and thermal degradation characterization of novel poly(phosphazene-aryl amides)

Zhao¹,

Guo

Li³

et al. 2012

Express Polym. Lett.

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Abstract. New fully aromatic poly(phosphazene-aryl amides) were prepared by polycondensation reaction of our synthesized aromatic diamine: 1,1,3,5-tetraphenoxy-4,6-bis(4-aminophenoxy)oligocyclotriphosphazene (monomer 1) with terephthaloyl dichloride. Their chemical structure and composition were characterized by elemental analysis, 1 H and 31 P NMR (Nuclear Magnetic Resonance), and FT-IR (Fourier transform infrared) spectroscopy, whereas their thermal degradation properties were determined by DSC (Differential Scanning Calorimetry) and TGA (Thermal Gravimertic Analysis) techniques. The solid residues of all samples were analysed by FT-IR and SEM (Scanning Electron Microscopy). Compared to conventional PPTA (poly(p-phenylene terephthamide)), PPAA (poly(phosphazene-aryl amide)) shows excellent thermal stability and solubility in polar protic solvents. All poly(phosphazene-aryl amides) show two thermal degradation in the temperature range 150-600°C. The monomer 1, due to its structure, shows the first maximum rate of thermal decomposition temperature around 150-350°C, which may be due to the decomposition of the P-O-C bone. Morphology of the solid residues by Scanning Electron Microscope exhibit that the granular of the solid residues gradual disappearance with the increase of monomer 1 content. The surface layer of PPAA solid residues has been grumous, for the syneresis of P-O-P took place.

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Section: Thermal Degradation Propertiessupporting

confidence: 78%

Synthesis and thermal degradation characterization of novel poly(phosphazene-aryl amides)

Zhao¹,

Guo

Li³

et al. 2012

Express Polym. Lett.

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“…As revealed in Table 3, the averaged value of EHC (av-EHC) for cured CTP-EP/DDM system decreases from 22.73 MJ kg À1 for cured DGEBA/DDM system to 16.65 MJ kg À1 . The reason is that the CTP-EP thermoset containing phosphazene group released noncombustible gases, such as volatile phosphide, N 2 , NH 3 and CO 2 during the combustion process [24,27,42], which could dilute flammable gases and reduce the oxygen concentration around the material. Although the chemical mechanism of action, such as scavenging free radicals in the flame, can not be characterized precisely in this paper, the nonflammable gases could play a role in the gas phase.…”

Section: Cone Calorimetry Of the Cured Epoxy Resinsmentioning

confidence: 99%

“…So it is desirable to obtain novel cyclotriphosphazene-based epoxy materials with excellent comprehensive performance. However, the phosphazene used as primary component for synthesizing the flame retardant epoxy resins was seldom reported [24,27,29,30] and the flame retardant mechanism needs to be further investigated.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and characterization of a novel epoxy resin based on cyclotriphosphazene and its thermal degradation and flammability performance

2014

Polymer Degradation and Stability

108

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“…Therefore, considering the environmental hazards associated with use of halogenated flame retardants, recent research has focused on development of halogen free flame retardants. [4][5][6][7][8] In contrast to conventional thermally cured and solvent-borne resins, UV-curable systems are widely used in various industries as well as academia due to their high efficiency, lack of volatile organic compounds (VOCs), lower energy consumption, ability to coat heatsensitive devices and circuits, lower processing cost, high chemical resistance, increased production capacity, and the broad variability of formulations. [9][10][11][12][13] Photopolymerizable resins are increasingly being used in various applications, mainly in the coating industry, graphic arts and microelectronics to replace conventional, thermally cured solvent-based coatings.…”

Section: Introductionmentioning

confidence: 99%

UV-curable behavior of phosphorus- and nitrogen-based reactive diluent for epoxy acrylate oligomer used for flame-retardant wood coating

2016

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Multifunctional phosphorus and nitrogen containing tris-diethanolamine spirocyclic pentaerythritol bisphosphorate reactive diluent (TDSPBRD) for epoxy acrylate oligomer was synthesized from spirocyclic pentaerythritol bisphosphorate diphosphoryl chloride, diethanolamine, and allyl chloroformate. The synthesized reactive diluent was utilized to formulate ultraviolet (UV)-curable wood coating. The weight fraction of reactive diluent in the coating formulation was varied from 5 to 25 wt% with constant photoinitiator concentration. The molecular structure of the reactive flame retardant was confirmed by Fourier transform infrared (FTIR), 1 H nuclear magnetic resonance (NMR) and 31 P NMR spectral analysis and energy dispersive spectroscopy (EDAX). Further, the effectiveness of the flame retardant behavior of the coatings was evaluated using the limiting oxygen index and UL-94 vertical burning test. Thermal stability was estimated from thermogravimetric analysis and differential scanning calorimetry. The effects of varying the concentration of TDSPBRD on the viscosity of the coating formulation along with the optical, mechanical and chemical resistance properties of the coatings were evaluated. The coatings gel content, water absorption behavior, and stain resistance were also studied.

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Synthesis, characterization, thermal properties and flame retardancy of a novel nonflammable phosphazene-based epoxy resin

Cited by 214 publications

References 36 publications

Synthesis and thermal degradation characterization of novel poly(phosphazene-aryl amides)

Synthesis and thermal degradation characterization of novel poly(phosphazene-aryl amides)

Synthesis and characterization of a novel epoxy resin based on cyclotriphosphazene and its thermal degradation and flammability performance

UV-curable behavior of phosphorus- and nitrogen-based reactive diluent for epoxy acrylate oligomer used for flame-retardant wood coating

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