Synthesis of Au–Sn alloy nanoparticles for lead-free electronics with unique combination of low and high melting temperatures

Tabatabaei, Salomeh; Kumar, Ashavani; Ardebili, Haleh; Loos, Peter J.; Ajayan, Pulickel M.

doi:10.1016/j.microrel.2012.04.008

Cited by 21 publications

(11 citation statements)

References 30 publications

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“…It was theoretically predicted 1,2 that the melting points of alloy nanoparticles are lower than the melting points of their macrosized (bulk) counterparts with the same chemical composition. This effect was also observed experimentally in metal nanoparticles 3,4 and nanoalloys: Au-Ag, 5 Au-Sn, 6 and Ag-Sn. 7,8 The melting point depression (MPD) is observed for pure metal nanoparticles as well as for liquidus and solidus lines of nanoalloys.…”

Section: Introductionsupporting

confidence: 74%

Heat-induced spinodal decomposition of Ag–Cu nanoparticles

Sopoušek

Zobač

Buršı́k

et al. 2015

Phys. Chem. Chem. Phys.

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Solvothermal synthesis was used for Ag-Cu nanoparticle (NP) preparation from metallo-organic precursors. The detailed NP characterization was performed to obtain information about nanoparticle microstructure and both phase and chemical compositions. The resulting nanoparticles exhibited chemical composition inside a FCC_Ag + FCC_Cu two-phase region. The microstructure study was performed by various methods of electron microscopy including high-resolution transmission electron microscopy (HRTEM) at an atomic scale. The HRTEM and X-ray diffraction studies showed that the prepared nanoparticles form the face centred cubic (FCC) crystal lattice where the silver atoms are randomly mixed with copper. The CALPHAD approach was used for predicting the phase diagram of the Ag-Cu system in both macro- and nano-scales. The predicted spinodal decomposition of the metastable Ag-Cu nanoparticles was experimentally induced by heating on an X-ray powder diffractometer (HT XRD). The nucleation of the Cu-rich phase was detected and its growth was studied. Changes in the Ag-rich phase were observed in situ by X-ray diffraction under vacuum. The heat treatment was conducted at different maximum temperatures up to 450 °C and the resulting particle product was analysed. The experiments were complemented by differential scanning calorimetry (DSC) measurements up to liquidus temperature. The start temperatures of the spinodal phase transformation and particle aggregation were evaluated.

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Section: Introductionsupporting

confidence: 74%

Heat-induced spinodal decomposition of Ag–Cu nanoparticles

Sopoušek

Zobač

Buršı́k

et al. 2015

Phys. Chem. Chem. Phys.

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“…However, lead is restricted in the application of electronics packaging owing to environmental concerns. Among the limited lead-free high temperature solder candidates, Au-based and Zn-Al solders are considered either cost-ineffective or exhibit poor processing performance [2,3]. Silver sintering is therefore considered to be one of the most promising lead-free alternatives; since the sintering process can be carried out at temperatures comparable to those used for Sn-based reflow soldering processes, whereas possessing high electrical and thermal conductivity and high reliability, in comparison to existing solders.…”

Section: Introductionmentioning

confidence: 99%

Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process

Dai

Li²,

Agyakwa

et al. 2020

Microelectronics Reliability

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This study investigates a time-reduced sintering process for die attachment, prepared, within a processing time of several seconds using dry nanosilver film. The effects of three main sintering parameters, sintering temperature (220 to 300 °C), sintering time (1 to 9 s) and bonding pressure (6 to 25 MPa) on the resultant shear strength are investigated using uniform design and single factor experimental trials. The shear strength data series for each of the experimental trials was statistically analyzed to indicate any deviation from normal distribution. The resulting shear strength values were regressed or fitted, and further analyzed by polynomial and kinetic-like equations to estimate the relationship between the shear strength and sintering parameters. The regression analysis for shear strength may not only be used for explaining mass transportation mechanisms, but also for identifying the proposed manufacturability of the time-reduced sintering process.

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“…However, lead is restricted in the area of electronic assemblies due to environmental and health concerns. For high temperature lead free alternatives, Au-based eutectics (or near eutectics) and ZnAl solders are either too expensive or exhibit poor solderability [3]. Therefore, transient liquid phase bonding and/or silver sintering have been considered as attractive lead-free alternatives [4]- [6].…”

Section: Introductionmentioning

confidence: 99%

Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling

Dai

Agyakwa

et al. 2018

IEEE Trans. Device Mater. Relib.

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13.5 mm × 13.5 mm sintered nano-silver attachments for power devices onto AlN substrates were prepared at 250 • C and a pressure of 10 MPa for 5 min and compared with Pb5Sn solder joint die attachments under constant current power cycling with an initial temperature swing of 50 • C-175 • C. Both effective thermal resistance and microstructural evolution of the samples were monitored using transient thermal impedance measurement and nondestructive X-ray computed tomography at regular power cycling intervals. The results showed a gradual increase in the effective thermal resistance of the Pb5Sn solder joints from 0.047 to 0.133 K/W from zero to 41k power cycles, followed by a rapid escalation to 0.5018 K/W at 52k cycles. This was accompanied with the formation and development of oblique cracks within the Pb5Sn die attachments until delamination occurred at the solder/device and solder/substrate interfaces. By contrast, the effective thermal resistance of the sintered Ag joints remained almost constant at 0.040 K/W up to 116k power cycles. This was explained in terms of thermally induced continuation of densification of the sintered structure and the formation and development of networked vertical cracks within the sintered Ag die attachments, some of which further extended into the Cu tracks of the AlN substrate. Index Terms-High lead solder joint, power cycling, sintered nanosilver joint, thermal impedance and microstructures.

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Synthesis of Au–Sn alloy nanoparticles for lead-free electronics with unique combination of low and high melting temperatures

Cited by 21 publications

References 30 publications

Heat-induced spinodal decomposition of Ag–Cu nanoparticles

Heat-induced spinodal decomposition of Ag–Cu nanoparticles

Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process

Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling

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