“…Sputtering is a conventional physical technique for the fabrication of thin films or creation of NPs directly on solid substrates from the bulk target in a vacuum and dry conditions. , Nonvolatile or low volatile liquids as the substrates, − e.g., silicone oils, ionic liquids, ,,, and liquid polymers, ,− have been used for obtaining NPs dispersed in liquids for a long time continuous sputtering. Compared with the traditional chemical reduction method, cosputtering can simultaneously produce metal atoms and clusters of two or more metals for making alloy NPs at room temperature regardless of the difference in redox potentials of metals and without using toxic reductants. − Moreover, it is capable of varying the properties of NPs by varying the size, composition, composition distribution, and structures of NPs via adjusting the sputtering parameters such as the currents applied to the metal targets. − Cosputtering onto liquid allows obtention of solid solution alloys of metal pairs that have miscibility gaps and/or form intermetallic compounds in the phase diagram such as Au/Pd, Pt/Au, Au/Cu, and Cu/Pd. − However, so far, there has been no report on cosputtering onto liquid at room temperature of Pt/Ag NPs below 3 nm, their fine structure, and whether solid solution alloys can be attained, especially for the composition in the miscibility gap. Furthermore, the correlation of particle size and composition varied with the metal pairs; that is, the size–composition relation is not obvious in cosputtered Au/Cu and Cu/Pd whereas highly correlated in Pt/Au NPs. − This relation has not been addressed for cosputtered Pt/Ag NPs.…”