Synthesis of Conductive Nano Ink Using 1-Octanethiol Coated Copper Nano Powders in 1-Octanol for Low Temperature Sintering Process

Her, Jaehak; Cho, Danee; Lee, Caroline Sunyong

doi:10.2320/matertrans.m2012363

Cited by 14 publications

(11 citation statements)

References 18 publications

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“…Its diffraction pattern in the inset shows that the surface has not been oxidized. Oxidation prevention by 1-Octanethiol has been discussed previously [16,17]. Therefore, it was confirmed that 1-Octanethiol layer was successfully coated on surface of each copper nanoparticle via coating system through TEM analysis.…”

Section: Fabrication and Characterization Of Copper Nanoink With Rgosupporting

confidence: 57%

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Oxidation Prevention Properties of Reduced Graphene Oxide Mixed with 1-Octanethiol-Coated Copper Nanopowder Composites

Cho

Choi

Pyo

et al. 2016

Journal of Nanomaterials

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1-Octanethiol-coated Cu nanoparticles were mixed with reduced graphene oxide (rGO) to fabricate Cu nanoinks with enhanced oxidation prevention. Graphene oxide (GO) was synthesized using modified Hummer’s method and rGO was reduced from GO using hydrazine hydrate. Copper nanoinks were fabricated with varying concentrations of rGO (Cu : rGO ratios of 100 : 1, 500 : 1, and 1000 : 1 wt.%). The coating layers on the copper nanoparticles and rGO were observed using transmission electron microscopy and characterized by X-ray photoemission spectroscopy, X-ray diffraction, and Raman spectroscopy. It was observed that surface roughness increased as the concentration of rGO in Cu patterns increased, and an optimized Cu : rGO weight ratio of 1,000 : 1 was established. After sintering, the electrical properties and corrosion resistance of copper patterns both with and without rGO were measured and monitored for 200 days. The copper pattern with rGO (Cu : rGO = 1,000 : 1) was found to maintain its initial resistivity (1.63 × 10−7 Ω·m) for 150 days. Corrosion tests were conducted to confirm the oxidation prohibition of rGO. The resistance polarization(Rp)of the copper pattern was measured to be 1.5 times higher than that of the copper pattern without rGO. Thus, rGO was shown to prevent oxidation and improve the conductivity of copper patterns.

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Section: Fabrication and Characterization Of Copper Nanoink With Rgosupporting

confidence: 57%

“…Sintering was conducted under H 2 gas (500 sccm) at a heating rate of 5 ∘ C/min ( Figure 1) [16]. The line resistivity of the sintered patterns was measured immediately after sintering and monitored for 200 days.…”

Section: Fabrication and Characterization Of Copper Nanoink With Rgomentioning

confidence: 99%

Oxidation Prevention Properties of Reduced Graphene Oxide Mixed with 1-Octanethiol-Coated Copper Nanopowder Composites

Cho

Choi

Pyo

et al. 2016

Journal of Nanomaterials

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“…Copper nanoparticles were synthesized by polyol method with an average diameter of 100nm by Lee et.al. 35 . Typical experimental procedure includes preparation of copper nanoparticles stabilized in PVP in ethylene glycol solution by polyol method 29 .…”

Section: Polyol Synthesismentioning

confidence: 95%

Copper conductive inks: synthesis and utilization in flexible electronics

Karthik

et al. 2015

RSC Adv.

170

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Conductive inks are a recent progress in electronics and have a promising future applications in flexible electronics and smart applications. In this review we tried to focus on a particular conductive ink, based on copper nanoparticles. Although wide research is being done all over the world, few complications are yet to be solved with perfection. We tried to focus on some of the complications involved in the synthesis and their various applications in the different fields of science. Conductive inks have promising applications in the present trend of science and technology. The main intention behind this review is to list out some of the best methods to synthesize copper nanoparticles according the category of synthesizing them. We chose copper nanoparticles synthesis and preparation of conductive inks because copper is a very abundant material possessing high conductivity (after silver), it has huge potential to replace expensive conductive inks made of silver, graphene, CNTs etc. The reason behind insisting on copper is also due to its properties such as ductility, malleability, thermal dissipation agent, possess anti microbial nature etc. In this review, we have listed out some of the best methods of synthesizing copper conductive ink and their usage in various printing techniques. Different methods of sintering for obtained conductive patterns are also included.

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“…The Cu oxidation was inhibited by the protective layers formed by Cu–S bonding of 1-octanethiol for 35 days [ 81 ]. Her et al prepared 1-octanethiol-protected Cu nanoparticles with an average diameter of 100 nm using the dry coating vaporized self-assembled multilayers (VSAMs) method to prevent the oxidation of Cu nanoparticles [ 82 ]. The thermogravimetry differential thermal analysis (TG/DTA ) curves indicated that 1-octanethiol could be removed at 150 °C, allowing the low-temperature sintering of the Cu nanoparticles.…”

Section: Surface Designs By Surface Protective Layers Against the mentioning

confidence: 99%

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Tomotoshi

Kawasaki

2020

Nanomaterials

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Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effective and abundant, as compared to Ag. Moreover, the migration tendency of Cu is less than that of Ag. Thus, recently, Cu-based inks/pastes have gained increasing attention as conductive inks/pastes for printed/flexible electronics. However, the disadvantages of Cu-based inks/pastes are their instability against oxidation under an ambient condition and tendency to form insulating layers of Cu oxide, such as cuprous oxide (Cu2O) and cupric oxide (CuO). The formation of the Cu oxidation causes a low conductivity in sintered Cu films and interferes with the sintering of Cu particles. In this review, we summarize the surface and interface designs for Cu-based conductive inks/pastes, in which the strategies for the oxidation resistance of Cu and low-temperature sintering are applied to produce highly conductive Cu patterns/electrodes on flexible substrates. First, we classify the Cu-based inks/pastes and briefly describe the surface oxidation behaviors of Cu. Next, we describe various surface control approaches for Cu-based inks/pastes to achieve both the oxidation resistance and low-temperature sintering to produce highly conductive Cu patterns/electrodes on flexible substrates. These surface control approaches include surface designs by polymers, small ligands, core-shell structures, and surface activation. Recently developed Cu-based mixed inks/pastes are also described, and the synergy effect in the mixed inks/pastes offers improved performances compared with the single use of each component. Finally, we offer our perspectives on Cu-based inks/pastes for future efforts.

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Synthesis of Conductive Nano Ink Using 1-Octanethiol Coated Copper Nano Powders in 1-Octanol for Low Temperature Sintering Process

Cited by 14 publications

References 18 publications

Oxidation Prevention Properties of Reduced Graphene Oxide Mixed with 1-Octanethiol-Coated Copper Nanopowder Composites

Oxidation Prevention Properties of Reduced Graphene Oxide Mixed with 1-Octanethiol-Coated Copper Nanopowder Composites

Copper conductive inks: synthesis and utilization in flexible electronics

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

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