“…However, their brittle nature due to its high cross-link density and poor resistance to crack propagation limits the applications in advanced aerospace structures. To overcome this problem various Engineering thermoplastics like polyether sulfone [2,3], polycarbonate [4,5], polyethylene tere phthalate [6,7], poly ether ether ketone/hydroxyl terminated poly (ether ether ketone) with pendant methyl groups (PEEKMOH) [8,9], Poly ether ether ketone/hydroxyl terminated poly ether ether ketone with pendant tertiary butyl groups [10][11][12][13] or poly (cyanoarylene ether)/hydroxyl terminated poly arylene ether nitrile with pendant tertiary butyl groups [14,15] have been used as a toughness modifiers for epoxy resin without sacrificing other thermomechanical properties. However no evidence of improvement in modulus, gas barrier property and in coefficient of thermal expansion (CTE) was reported in the literature.…”