Magnesium silicides can be used for thermoelectric energy conversion, as high values of figure of merit zT were obtained for n-type (1.4 at 500 °C) and p-type (0.55 at 350 °C) materials. This, however, needs to be complemented by low resistive and stable contacting to ensure long-term thermogenerator operation and minimize losses. In this study, we selected Cu and Ni 45 Cu 55 as contacting electrodes for their high electrical conductivity, similar coefficient of thermal expansion (CTE) and good adhesion to Mg 2 (Si,Sn). Both electrodes were joined to Mg 2 Si 0.3 Sn 0.7 pellets by hot pressing in a current-assisted press. Microstructural changes near the interface were analyzed using SEM/EDX analysis, and the specific electrical contact resistance r c was estimated using a travelling potential probe combined with local Seebeck scanning. Good contacting was observed with both electrode materials. Results show low r c with Cu, suitable for application, for both n-type and p-type silicides (< 10 µΩ•cm 2 ), with the occurrence of wide, highly conductive diffusion regions. Ni 45 Cu 55 joining also showed relatively low r c values (~ 30 µΩcm 2 ) for n-and p-type, but had a less inhomogeneous reaction layer. We also performed annealing experiments with Cu-joined samples at 450 °C for one week to investigate the evolution of the contact regions under working temperatures. r c values increased (up to ~ 100 µΩcm 2 ) for annealed n-type samples, but remained low (< 10 µΩcm 2 ) for p-type. Therefore, Cu is a good contacting solution for p-type Mg 2 (Si,Sn), and a potential one for n-type if the diffusion causing contact property degradation can be prevented.