2013
DOI: 10.2298/jmmb120927025k
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Synthesis of silver/copper nanoparticles and their metalmetal bonding property

Abstract: The present paper describes a metal-metal bonding technique using Cu nanoparticles containing Ag nanoparticles (Ag/Cu nanoparticles). The Ag/Cu nanoparticles with particle sizes of 30-85 nm and crystal sizes of 9.3 nm for Cu and 8.1 nm for Ag were produced by reducing 5.0x10-3 M Ag+ (AgClO4) and 5.0x10-3 M Cu2+ (Cu(NO3)2) simultaneously with 1.0 M hydrazine in aqueous solution containing 1.0 g/L poly(vinylpyrrolidone) as dispersing agent and 5Ч10-3 M citric acid as stabilizer at room temperature. Discs o… Show more

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Cited by 16 publications
(10 citation statements)
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“…The Young`s modulus is a crucial parameter, as it ensures a strong connection between the implant and the bone [3]. The materials to bone regeneration should have a value of Young`s modulus similar or lower that of a natural human bone (15)(16)(17)(18)(19)(20) [12,13]. Poor mechanical properties caused the fast dissolution of the coatings in a physiological environment [31].…”
Section: Fig 2 Sem Images (With Different Magnifications) and Eds Smentioning
confidence: 99%
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“…The Young`s modulus is a crucial parameter, as it ensures a strong connection between the implant and the bone [3]. The materials to bone regeneration should have a value of Young`s modulus similar or lower that of a natural human bone (15)(16)(17)(18)(19)(20) [12,13]. Poor mechanical properties caused the fast dissolution of the coatings in a physiological environment [31].…”
Section: Fig 2 Sem Images (With Different Magnifications) and Eds Smentioning
confidence: 99%
“…There are some reports on possible adverse e effects of both alloying elements of the Ti6Al4V: vanadium may provoke cytological responses and neurogenic disorders, and aluminum softens bone, do damage to nerve cells and disturbance of the function of enzymes [7][8][9][10]. The titanium alloy Ti13Zr13Nb possesses no harmful elements (aluminum and vanadium), is characterized by relatively low Young modulus (~ 80 GPa ) [8] compared to Ti6Al4V (~110 GPa) [11] and is more mechanically compatible with the bone (15)(16)(17)(18)(19)(20) [12,13].…”
Section: Introductionmentioning
confidence: 99%
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“…Dimples accompanied with sharp tips appear on the surfaces of the copper discs bonded with the Ag 0 Cu 100 and the Ag 25 Cu 75 nanoparticles. Metallic materials often form such dimples in strongly bonded regions when they are separated with shear stress (Yan et al 2013;Kobayashi et al 2013b). These observations of dimples support the existence of strong bonding.…”
Section: Bonding In Hydrogen Gasmentioning
confidence: 99%
“…The standard procedure for obtaining AgNPs is a chemical reduction of Ag I salts into metallic Ag 0 , which easily aggregate forming metallic clusters . This is made by using appropriate reducing agents which act also as colloidal suspension stabilizers (usually trisodium citrate, sodium borohydride, glucose, chitosan, hydrazine).…”
Section: Introductionmentioning
confidence: 99%