System for Cooling of Electronic Components

Васильев, Л. Л.; Grakovich, L. P.; Dragun, Łukasz; Zhuravlev, A. S.; Olekhnovich, V. A.; Rabetskii, M. I.

doi:10.1007/s10891-017-1543-8

Cited by 13 publications

(2 citation statements)

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“…As to their shape, the heat pipes can be of cylindrical [11,12,15], L-like [16], U-like [15], Т-like [15], flat [28], as well as of other shapes. In some applications, for example, for internal lighting of premises with low ceilings as well as for that in cabins of automobile, marine and city transport, in carriages, etc., it is desirable to mount compact LED luminaires with minimal dimensions along their height.…”

Section: Introductionmentioning

confidence: 99%

Optimization of the cooling system design for a compact high-power LED luminaire

Pekur¹,

Nikolaenko²,

Сорокин³

2020

Semicond. phys. quantum electron. and optoelectron.

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Using the method of computer modelling, considered in this paper is optimization of a passive air system design for cooling the powerful LED luminaire based on heat pipes and cooling rings. Thermal and mass characteristics of the cooling system have been studied for various design parameters: distance between rings, thickness of ring materials and thermal loads. It has been shown that, to provide a minimal case temperature of LED source, the optimal distance between cooling rings should be 6 mm, but in this case the mass of cooling system is not least. To reduce the luminaire mass, it is reasonable to choose the distance between the cooling rings equal to 8 mm. Then the temperature of light source increases by only 1.8 °С, or by 2.2%, while the mass of cooling system reduces by 1357 g, or by 20.5%. At the same time, lowering the ring thickness from 2 down to 0.8 mm can in addition reduce this mass by 2700 g, or by 48.6%. However, when doing so the temperature of LED source case is increased by 5.9 °С. The offered cooling system based on heat pipes is capable to provide the thermal resistance 0.131 °С/W when scattering the thermal power 500 W under the maximum temperature of LED source crystal 135.5 °С. Recommendations for application of the developed cooling system have been formulated.

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Section: Introductionmentioning

confidence: 99%

Optimization of the cooling system design for a compact high-power LED luminaire

Pekur¹,

Nikolaenko²,

Сорокин³

2020

Semicond. phys. quantum electron. and optoelectron.

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“…The temperature and cooling efficiency are reduced. Expanding the possibility of air cooling of semiconductor elements of MED with high heat dissipation can be using two-phase heat transfer devices, in particular flat vapor chambers [19][20][21] and heat pipes [22][23][24][25][26][27]. They allow the local heat stream from the MED element to be efficiently dissipated to a larger heat transfer surface area of the heat pipe or the vapor chamber.…”

Section: Introductionmentioning

confidence: 99%

Archives of Thermodynamics

Nikolaenko,

Baranyuk,

Rohachov

et al. 2020

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Promising cooling systems for high-power electronic elements are those based on vapor chambers and heat pipes which allow for the local heat flow to be dispersed from the electronic element to a larger surface area of the vapor chamber or the heat pipe. To reduce the thermal resistance of the cooling system, a finned radiator is installed on the outer surface of the vapor chamber or heat pipe. The authors propose a new design of the radiator which increases the heat transfer efficiency. The paper presents results of numerical simulation of heat transfer and aerodynamic resistance of the heat transfer surface with lamellar-split finning. The comparative analysis of heat transfer and aerodynamics was carried out for three types of radiators: with lamellar smooth finning, with lamellar split finning and with the sections of split finning rotated 30 • against the air flow. It is shown that cutting the fins and rotating the split sections leads to an increase in heat transfer intensity and increase in aerodynamic resistance. The obtained results may be useful in the design of cooling systems for computer processors, power amplifiers for transmitting modules, energy-saving solid-state light sources, etc.

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