System-in-package technologies for photonics

Abstract

System-in-package technology is announced as one of the key technologies, which enables the continued increase in functional density and decrease in cost per function required to maintain the progress of electronics by utilizing 3D through innovation in packaging and interconnect technology. A key bottleneck to the realization of high-performance microelectronic systems is the lack of low latency, high-bandwidth, and high density off-chip interconnects. Photonics could overcome these challenges and leverage low-latency and high bandwidth communication within next generation architectures. In this paper state-of-the-art approaches will be discussed and the requirements in 3D integration perspective of converging platforms will be addressed

Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects

“…Further integration of functionalities demands a concept of a CMOS compatible underlying technology, which will be developed to enable next generation of systems. The technology should allow advanced component engineering together with complex product design in a short time for optoelectronic systems by reducing total cost, and towards 3D heterogeneous integration the microsystems can bridge between micro and nano worlds [26].…”