2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) 2020
DOI: 10.1109/estc48849.2020.9229748
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System-Level Flip-Chip Ball Grid Array Solder Joint Reliability Assessment Under Different Methodologies and Correlation with Accelerated Thermal Cycling Experimental Data

Iulia–Eliza Ţinca
1
,
Prabhath Rai2,
David Faller
3
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