Systematic configuration of coarsely discretized 3D EM solvers for reliable and fast simulation of high-frequency planar structures

Rayas‐Sánchez, José E.; Brito‐Brito, Zabdiel; Cervantes-González, Juan C.; López, Carlos

doi:10.1109/lascas.2013.6519093

Cited by 4 publications

(2 citation statements)

References 8 publications

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“…Mesh element sizes were meticulously tailored to the geometric complexities of the filter design. We used a duroid substrate for the structure, neglecting metallic and dielectric losses, (δ) = 0 and σ = 0 facilitating an optimized performance of the low-pass filter that has been widely studied in [23] and is depicted in Figure 2. The coarse mesh was intricately engineered to enhance the resolution of electromagnetic phenomena.…”

Section: Simulation Parameters and Design Space Explorationmentioning

confidence: 99%

Integrative BNN-LHS Surrogate Modeling and Thermo-Mechanical-EM Analysis for Enhanced Characterization of High-Frequency Low-Pass Filters in COMSOL

Davalos-Guzman,

Chavez-Hurtado,

Brito-Brito

2024

Micromachines

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This paper pioneers a novel approach in electromagnetic (EM) system analysis by synergistically combining Bayesian Neural Networks (BNNs) informed by Latin Hypercube Sampling (LHS) with advanced thermal–mechanical surrogate modeling within COMSOL simulations for high-frequency low-pass filter modeling. Our methodology transcends traditional EM characterization by integrating physical dimension variability, thermal effects, mechanical deformation, and real-world operational conditions, thereby achieving a significant leap in predictive modeling fidelity. Through rigorous evaluation using Mean Squared Error (MSE), Maximum Learning Error (MLE), and Maximum Test Error (MTE) metrics, as well as comprehensive validation on unseen data, the model’s robustness and generalization capability is demonstrated. This research challenges conventional methods, offering a nuanced understanding of multiphysical phenomena to enhance reliability and resilience in electronic component design and optimization. The integration of thermal variables alongside dimensional parameters marks a novel paradigm in filter performance analysis, significantly improving simulation accuracy. Our findings not only contribute to the body of knowledge in EM diagnostics and complex-environment analysis but also pave the way for future investigations into the fusion of machine learning with computational physics, promising transformative impacts across various applications, from telecommunications to medical devices.

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Section: Simulation Parameters and Design Space Explorationmentioning

confidence: 99%

Integrative BNN-LHS Surrogate Modeling and Thermo-Mechanical-EM Analysis for Enhanced Characterization of High-Frequency Low-Pass Filters in COMSOL

Davalos-Guzman,

Chavez-Hurtado,

Brito-Brito

2024

Micromachines

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“…Having a fast coarse model is key to the performance of the algorithm. Therefore, a systematic methodology to fmd suitable 3D EM solver configurations for models with low resolution meshing was developed in [14]. The technique has been applied for instance to the return loss minimization of a single ended package interconnect in [15].…”

Section: Introductionmentioning

confidence: 99%

Intel Labs Mexico - Leading Industrial Research in Latin America

Camacho-Perez

Hernandez-Sosa

Alcocer-Ochoa

et al. 2014

2014 IEEE MTT-S International Microwave Symposium (IMS2014)

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Intel Labs is a research arm at Intel focused on delivering innovations to fuel Intel's growth and technology leadership. Intel Labs Mexico, one of the research groups of Intel Labs globally, has been leading research and technology development in Mexico and Latin America since its creation in 2005. This paper provides an overview of the main research areas at Intel Labs Mexico as well as the corresponding published contributions.Index Terms -baseband processor, microwave research, MIMO channel, power integrity, radio frequency interference, signal integrity, space mapping

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Enhanced procedure to setup the simulation bounding box and the meshing scheme of a 3D finite element EM simulator for planar microwave structures

Brito‐Brito

Rayas‐Sánchez

Chavez-Hurtado

2015

2015 IEEE MTT-S International Microwave Symposium

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Systematic configuration of coarsely discretized 3D EM solvers for reliable and fast simulation of high-frequency planar structures

Cited by 4 publications

References 8 publications

Integrative BNN-LHS Surrogate Modeling and Thermo-Mechanical-EM Analysis for Enhanced Characterization of High-Frequency Low-Pass Filters in COMSOL

Integrative BNN-LHS Surrogate Modeling and Thermo-Mechanical-EM Analysis for Enhanced Characterization of High-Frequency Low-Pass Filters in COMSOL

Intel Labs Mexico - Leading Industrial Research in Latin America

Enhanced procedure to setup the simulation bounding box and the meshing scheme of a 3D finite element EM simulator for planar microwave structures

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