2016 IEEE International Electron Devices Meeting (IEDM) 2016
DOI: 10.1109/iedm.2016.7838493
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Systematic validation of 2x nm diameter perpendicular MTJ arrays and MgO barrier for sub-10 nm embedded STT-MRAM with practically unlimited endurance

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Cited by 39 publications
(14 citation statements)
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“…STT-MRAM technology is considered to be the most viable solution owing to its attractive properties such as CMOS process compatibility, high operation speeds, superior endurance, and negligible leakage, thus, making it an ideal solution for low power, embedded electronics [1][2][3]. Significant resources have been invested in the past decade at major foundries and tool suppliers to optimize this technology for last-level cache (LLC) memory, microcontroller units (MCU), eFLASH, and automotive applications [2,[4][5][6][7][8][9][10][11][12]. Despite these excellent advancements, some challenges remain.…”
Section: Introductionmentioning
confidence: 99%
“…STT-MRAM technology is considered to be the most viable solution owing to its attractive properties such as CMOS process compatibility, high operation speeds, superior endurance, and negligible leakage, thus, making it an ideal solution for low power, embedded electronics [1][2][3]. Significant resources have been invested in the past decade at major foundries and tool suppliers to optimize this technology for last-level cache (LLC) memory, microcontroller units (MCU), eFLASH, and automotive applications [2,[4][5][6][7][8][9][10][11][12]. Despite these excellent advancements, some challenges remain.…”
Section: Introductionmentioning
confidence: 99%
“…Till now, materials with in-plane anisotropy have been practically used in STT-MRAM [ 10 ]. However, PMA materials can provide superior STT-MRAM properties such as excellent thermal stability, lower power consumption, and increased storage density, which can take the MRAM technology below the 10 nm node [ 11 ].…”
Section: Introductionmentioning
confidence: 99%
“…We recently demonstrated deterministic switching induced by current pulses shorter than 200 ps in dots made of Pt/Co/AlOx stacks [12]. However, the use of a Pt seed layer in MgO based MTJ does not allow to reach the high TMR ratio needed for memory applications [16], [17] (>100%), as it promotes a (111) fcc texture while a (100) bcc structure at the CoFe/MgO interface is needed to achieve high TMR [18]- [20]On the contrary, the Ta/FeCoB/MgO/FeCoB MTJ stacks commonly used for STT-MRAM seem ideal for SOT-MRAM since they combine a high TMR, a perpendicular magnetization [21] and a large spin Hall effect in Ta [22]. In this article, we demonstrate that magnetization switching can be achieved by very short current pulses (down to 400 ps) in Ta/FeCoB/MgO three-terminal SOT-MRAM memory cells.…”
mentioning
confidence: 99%