The use of nanoparticle
surface chemistry to direct metal
deposition
has been well-studied in the modification of metal nanoparticle substrates
but is not yet well-established for metal chalcogenide particle substrates,
although integration of these particles into nanoheterostructures
is of high interest. In this report, we investigate the effect of
Cu2–x
Se surface chemistry on the
morphology of metal deposition on these plasmonic semiconductor nanoparticles.
Specifically, we functionalize Cu2–x
Se nanoparticles with a suite of 12 different ligands and investigate
how different aspects of the ligand structure do or do not impact
the morphology and extent of subsequent metal deposition on the Cu2–x
Se surface. Surprisingly, our results
indicate that the morphology of the resulting metal deposits and the
extent of metal deposition onto the existing Cu2–x
Se particle substrate are indistinguishable for the
majority of ligands tested. An exception to these findings is observed
for particles functionalized by quaternary alkylammonium bromides,
which exhibit statistically distinct metal deposition patterns compared
to all other ligands tested. We hypothesize that this unique behavior
is due to a cooperative binding mechanism of the quaternary alkylammonium
bromides to the surface of copper selenide. Taken together, these
results yield both new strategies for controlling postsynthetic modification
of copper selenide nanoparticles and also reveal limitations of surface
chemistry-based approaches for this system.