Tailoring the physical properties of electrodeposited CoNiReP alloys with large Re content by direct, pulse, and reverse pulse current techniques

Abstract

Please cite this article in press as: S. Pané, et al., Tailoring the physical properties of electrodeposited CoNiReP alloys with large Re content by direct, pulse, and reverse pulse current techniques, Electrochim. Acta (2013) b s t r a c tThe composition, surface morphology and structure of CoNiReP alloy films with large Re content (up to 27 at%), obtained in a citrate-glycine based electrolyte have been studied as a function of the electrodeposition technique. Direct current (DC), pulse plating (PP) and reverse pulse plating (RPP) were considered with cathodic current densities from −50 mA cm −2 to −250 mA cm −2 . The mechanical and magnetic properties have been analyzed and the data obtained has been correlated with composition and crystallographic structure. For values of j (DC), j on (PP) and j c (RPP) below −100 mA cm −2 , Co-rich, Pcontaining deposits are obtained. Beyond these current densities, both the quantities of Ni and Re increase simultaneously at the expense of Co and P, the latter virtually falling to zero. The highest Re percentage (25-27 at%) was achieved in both PP and RPP conditions at a cathodic pulse of −250 mA cm −2 . All the films were either entirely nanocrystalline in nature or partially amorphous. Hardness values as high as 9.2 GPa have been found in PP plated Co 64 Ni 18 Re 18 deposits. Besides the large hardness, the incorporation of Re in the films leads to high elastic recovery values. The magnetic character of the deposits ranges from soft to semi-hard ferromagnetic.

Microstructure and composition of pulse plated Re–Ni alloys on a rotating cylinder electrode

“…The first dominant peak of the spectra, actually fit as two peaks centered at 40.97°and 41.37°, may correspond to the (1 0 0) and (0 0 2) planes of a solid solution of Re included into an hcp-Ni lattice (JCPDS card #01-089-7129). Although the match is not perfect, a similar crystallography was reported by Pané et al in their analysis of CoNiReP deposits [26,27]. Assuming an hcp Ni-Re solid solution of the proper composition (taken from Fig.…”

A comparative study of the influence of the deposition technique (electrodeposition versus sputtering) on the properties of nanostructured Fe70Pd30 films

“…Results indicate that this parameter is similar for both sputtered and electrodeposited films and it is about 0.05-0.06. Similar hardness to reduced elastic modulus ratios were found in nanostructured Co-Ni-Re-P alloys fabricated by electrodeposition with 18 at.% of rhenium as refractory metal [45]. The H 3 B /E 2 r ratio, which allows to estimate the material's ability to dissipate energy at plastic deformation during loading, is about 0.02 (and a bit less for the thinnest films).…”

Effect of Pulse On-Time and Peak Current Density on Pulse Plated Re-Ni Alloys

“…A similar peak was observed in our earlier work, 11 which was thought to correspond to a (002) plane of a solid solution of Re atoms included into an hcp-Ni lattice (JCPDS card #01-089-7129). 11,22,23 The doubling of the Re-content in Samples 2 and 3 relative to Samples 1 and 4 supports the suggestion that Peak #1 may correspond to a Re-Ni solid solution found exclusively in the smooth samples. Additionally, the appearance of hcp-Ni Peak #1 in Samples 2 and 3 Figure 8.…”