2014
DOI: 10.1109/ted.2014.2357795
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TC-LIGBTs on the Thin SoI Layer for the High Voltage Monolithic ICs With High Current Density and Latch-Up Immunity

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Cited by 12 publications
(2 citation statements)
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“…1) to the P + emitter. Once the total hole current density flowing laterally beneath the region A reaches a critical value, the parasitic bipolar transistor that consists of the N + emitter, P‐body and N‐drift is activated [8]. In the proposed structure, negative voltage is applied to G2.…”
Section: Structure and Mechanismmentioning
confidence: 99%
“…1) to the P + emitter. Once the total hole current density flowing laterally beneath the region A reaches a critical value, the parasitic bipolar transistor that consists of the N + emitter, P‐body and N‐drift is activated [8]. In the proposed structure, negative voltage is applied to G2.…”
Section: Structure and Mechanismmentioning
confidence: 99%
“…Lateral insulated gate bipolar transistor (LIGBT) is widely applied to power integrated circuits (ICs) due to its voltage control and low power dissipation. [1][2][3] On the one hand, the breakdown voltage (BV) is a key property for the LIGBT and it is improved by the trench oxide layer (TOL) technology. [4][5][6] On the other hand, the reverse conduction capability is another key property for the LIGBT, and the reverse conducting LIGBT (RC-LIGBT) is introduced to integrate the IGBT and the free-wheeling diode (FWD) into one monolithic chip.…”
Section: Introductionmentioning
confidence: 99%