Technical review of characterization methods for thermal interface Materials (TIM)

Goel, Narendra S.; Anoop, T.K.; Bhattacharya, Anandaroop; Cervantes, José-Antonio; Mongia, Rajiv; Machiroutu, S.V.; Lin, Hau-Lan; Huang, Ya-Chi; Fan, Kuang-Cheng; Denq, Bar-Long; Liu, Chen–Hua; Lin, Chi‐Hui; Tien, Chi-Wei; Pan, J.-H.

doi:10.1109/itherm.2008.4544277

Cited by 27 publications

(28 citation statements)

References 24 publications

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“…Figure 3 illustrates the schematic of ASTM TIM tester, which is a wellestablished metrology for measuring thermal resistances or effective thermal conductivities of a TIM sample at various load conditions [14]. Some advantages of this metrology include the controlled co-planarity between the surfaces of interest, the ability to measure the TIM thickness, the ability to apply an accurate pressure on the TIM, and a controlled uniform temperature at the TIM-to-surface interface [3,4]. An example of the data collected using this metrology is shown in Fig.…”

Section: Experimental Methodology Developments 21 Characterization Omentioning

confidence: 99%

“…Mobile personal computer (PC) platform designs vary significantly from designer to designer [1][2][3][4]; however, the pursuit of the thinnest possible systems is a consistent trend across the mobile PC industry. The prevailing desire for z-height reduction drives the need for thinner internal components.…”

Section: Introductionmentioning

confidence: 99%

“…The second effect is that the load and pressure that can be generated between the silicon dice and the thermal solution tends to be limited, due to the reduced stiffness of the thin system components [13]. Figure 1(a) illustrates a representative thermal solution design (also known as, remote heat exchange) [1][2][3][4]. Remote heat exchange is the predominant design for cooling of high-powered SoC package and system components with dedicated active cooling.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

Uppal

Peterson

Chang

et al. 2019

Journal of Electronic Packaging

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The demands for both thinner bare-die ball grid array (BGA) packages and thinner thermal solutions have added complexity for the thermal enabling design and material options associated with system on chip packages in mobile personal computer (PC) platforms. The thermomechanical interactions between the bare-die package and the thermal solution are very critical, creating the needs for: (1) an in-depth thermomechanical characterization to understand their impacts on product quality and performance and (2) a simple and yet robust modeling methodology to analyze design parameters using a commercially available software. In this paper, experimental metrologies and modeling methodology are developed with the details of contents documented. Validation of the newly developed tools and recommendation/guidance are also discussed for detailed assessments of thermomechanical tradeoffs for optimal design spaces for next-generation mobile platforms.

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Section: Experimental Methodology Developments 21 Characterization Omentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

Uppal

Peterson

Chang

et al. 2019

Journal of Electronic Packaging

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show abstract

“…Input values can be, for example, decomposition temperatures from thermogravimetric analysis (TGA) measurements at different heating rates. Such an approach has been described by Ozawa, Flynn, and Wall [43] and can be applied to thermal interface materials [44]. The regression line yields the factors of the Arrhenius equation, which in turn helps to estimate the thermal lifetime of a TIM as a function of the operating temperature, as shown in Figure 4.…”

Section: General Considerations and Examplesmentioning

confidence: 99%

Methods for Durability Testing and Lifetime Estimation of Thermal Interface Materials in Batteries

Stadler

Maurer

2019

Batteries

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To ensure sufficient thermal performance within electric vehicle (EV) batteries, thermal interface materials (TIMs), such as pastes or adhesives, are widely used to fill thermally insulating voids between cells and cooling components. However, TIMs are composite materials that are subject to degradation over the battery’s lifetime. Using TIMs for battery applications is a new and emerging topic, creating the need to rapidly acquire knowledge about appropriate lifetime testing and evaluation methods, in close collaboration with the battery manufacturers. This paper reviews suitable methods for durability testing as well as basic modeling approaches which allow for the transfer of laboratory results to the longtime behavior of interface materials during a vehicle’s lifetime.

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“…The uniformity of a TIM layer is typically determined by assembly processes and thermomechanical stresses experienced in service, and therefore, experimental characterization approaches that evaluate the evolution of performance in situ, during the course of thermomechanical cycling, are required for obtaining real-time feedback on the TIM design. Methods for experimental evaluation of TIM layers include direct evaluation of thermal performance [1,4,6,7], indirect void detection by infrared imaging [8,9] or infrared microscopy [10], and physical characterization. Firstorder physical characterization of voids may either be performed nondestructively with transparent substrates which cannot mimic TIM-substrate thermomechanical interactions experienced in real applications, or by destructive investigation which only provides data at a single point in time [7].…”

Section: Introductionmentioning

confidence: 99%

Near-field focusing sensor for characterization of void content in thin dielectric layers

Taylor¹,

Garimella²

2014

Meas. Sci. Technol.

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A sensor concept is developed and analyzed for in situ characterization of a thin dielectric layer.An array of long, planar electrodes is flush-mounted into opposing faces of two substrates on either side of the dielectric layer. The substrates are oriented such that the lengthwise dimensions of the opposing electrodes are orthogonal. Capacitance is measured between single electrode pairs on opposite substrates while all other electrodes are grounded. The electric field between the active electrodes is sharply focused at their crossing point, resulting in high sensitivity to void content in a square detection zone of the dielectric layer. For a fixed interfacial gap size, direct proportionality of the capacitance with void fraction within the detection zone is poor for high electrode-to-electrode spacing on the substrates, but improves dramatically as this spacing is reduced. Three methods of deriving a simulation-based sensitivity response of measured capacitance to any arbitrary two-dimensional void geometry are investigated. The best method requires data from simulations of an empty air gap and a TIM-filled gap, and uses a reduced-order superposition technique to predict the normalized capacitance value obtained for any void geometry to within 10% of that predicted by a highly-fidelity direct simulation. The sensing technique is demonstrated using manually introduced voids of 250 µm to 2000 µm diameter in a 254 µm-thick interface material layer with a dielectric constant of 4.7. The relationship of the capacitance to the void fraction is shown to fall within the predicted bounds.

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Technical review of characterization methods for thermal interface Materials (TIM)

Cited by 27 publications

References 24 publications

Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

Methods for Durability Testing and Lifetime Estimation of Thermal Interface Materials in Batteries

Near-field focusing sensor for characterization of void content in thin dielectric layers

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