“…In this case, the technological processes of oxidation in a diffusion furnace [ 21 ], explosive photolithography and electron–beam deposition [ 21 , 22 ], laser cutting [ 3 , 21 , 24 ], low-pressure chemical vapor deposited (LPCVD) [ 22 ], plasma-enhanced chemical vapor deposited (PECVD) [ 22 ], focused ion beam (FIB) [ 22 ], deep reactive ion etching (DRIE) [ 3 ], [ 22 ] were used. Over the next 10 years, these technologies were significantly developed and, nowadays, we can discuss the presence of several tested different solutions, which make it possible to successfully manufacture conversion elements with high sensitivity and good repeatability [ 4 , 17 , 18 , 19 , 20 ].…”