Technology of Standard SMT Components Embedded Into PCB by Using Different Materials as Filling Masses

Abstract

The technique of embedding components inside printed circuit boards (PCBs) is described, using different filling masses. To investigate the possibility of placing the components inside the printed circuit board, a residual circuit breaker with an overload protection (RCBO) system was adapted. Four types of fillings (two epoxy and two silicone) were used in the tests, which were carried out showing the full functionality of the systems embedded in the PCB, regardless of the applied sealing compound. A certain disadvantage was the shrinkage of the applied masses, which was visible in some cases in the occurrence of gaps in the flooding spaces. However, it should be emphasized that the tests were preliminary and that the adjustment of the filling shrinkage will be optimized in subsequent tests.