1994
DOI: 10.1007/bf01367755
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Technology tools for a high precision accelerometer in bulk micromechanics

Abstract: The high precision accelerometer consists of 5 silicon wafers and packages by silicon fusion bonding. The sensor has a capacitance measuring principle and works in an open loop or closed loop operation mode. The etching process for the realization of thin beams and the seismic mass, the silicon fusion bonding and the metallization process are described.

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Cited by 4 publications
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