TEM microstructural analysis of As-Bonded Al–Au wire-bonds

Karpel, Adi; Gür, Gökçe; Atzmon, Z.; Kaplan, Wayne D.

doi:10.1007/s10853-007-1592-z

Cited by 38 publications

(22 citation statements)

References 13 publications

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“…These flaws, which are known as solidification voids, and are formed inside the intermetallic region, are the result of the volume changes upon the formation of the Al-Au intermetallic. Karpel et al [27] also noted that increasing the silicon die temperature increased the shear strength of the ball bond as a result of further intermetallic compound formation. Figure 16 shows the relationship between shear strength and silicon die temperature obtained by Karpel et al [27].…”

Section: Transmission Electron Microscopy (Tem) Analysismentioning

confidence: 98%

“…Karpel et al [27] also noted that increasing the silicon die temperature increased the shear strength of the ball bond as a result of further intermetallic compound formation. Figure 16 shows the relationship between shear strength and silicon die temperature obtained by Karpel et al [27]. Ji et al [28] used high-resolution transmission electron microscopy (HRTEM) to analyse the Au wire bonding mechanism.…”

Section: Transmission Electron Microscopy (Tem) Analysismentioning

confidence: 98%

“…Several researchers have used TEM to examine the wire bonding mechanism in more detail [27][28][29][30]. Karpel et al [27] indicated that during the bonding stage, ultrasonic and thermal activation can result in the formation of a liquid state Fig.…”

Section: Transmission Electron Microscopy (Tem) Analysismentioning

confidence: 99%

“…Karpel et al [27] indicated that during the bonding stage, ultrasonic and thermal activation can result in the formation of a liquid state Fig. 14 FEA image showing the stresses in a bonded ball [24] at the bond interface.…”

Section: Transmission Electron Microscopy (Tem) Analysismentioning

confidence: 99%

“…Some of the methods, namely footprint morphology, intermetallic coverage, microstructural and frictional bonding analyses, have concluded that solid-state diffusion is the main mechanism of thermosonic Au wire bonding [1,[3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19]. However, a new possible bonding mechanism (liquid-state diffusion) has been proposed based on TEM examinations [27][28][29][30]. Each method for analysing the bonding mechanisms of thermosonic Au wire bonding has its own advantages and disadvantages, but further improvement is still possible.…”

Section: Introductionmentioning

confidence: 99%

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Some thoughts on bondability and strength of gold wire bonding

et al. 2012

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The bonding mechanisms of gold, to give the desired strength of wire bonding, still require detailed investigation, including establishing adequate and reliable testing procedures. The current practices for analysing the mechanisms of wire bonding are inadequate and do not provide a comprehensive picture. This is because the focus of the tests is not clear, which causes variation in the results obtained, changing the conclusions about the responsible mechanism. Furthermore, as the size of Au wire bonds decreases, the mechanism responsible for thermosonic Au wire bonding may change. This paper provides a comprehensive analysis of the current and possible future methods for elaborating the bonding mechanism and strength of thermosonic Au wire bonds. We discuss the testing methods, their limitations and advantages, and suggest ways in which they can be improved.

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Section: Transmission Electron Microscopy (Tem) Analysismentioning

confidence: 98%