TEM study on the electrical discharge machined surface of single-crystal silicon

Murray, James W.; Fay, Michael W.; Kunieda, Masanori; Clare, Adam T.

doi:10.1016/j.jmatprotec.2012.11.028

Cited by 39 publications

(9 citation statements)

References 25 publications

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“…W-sample were cut with Electrical Discharge Machining (EDM) technique and it is well known that the surface integrity of materials machined by EDM is typically poor 32 . The presence of significant carbon and oxides contamination at surface after machining 33,34 are responsible of an evolution of optical properties of materials. Moreover, the contamination depends on the physicalchemical conditions present during EDM machining and it can change from one sample to another cut from the same batch.…”

Section: Applicationmentioning

confidence: 99%

A high power laser facility to conduct annealing tests at high temperature

Minissale

Durif

Hiret

et al. 2020

Review of Scientific Instruments

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The knowledge of materials properties and their behavior at high temperatures is of crucial importance in many fields. For instance annealing phenomena occuring during the thermomechanical processing of materials, such as recrystallization, have long been recognized as being both of scientific interest and technological importance. Different methods are currently used to study annealing phenomena and submit metals to heat loads. In this work, we present the design and the development of a laser-based facility for annealing tests. This experimental setup enables studies at the laboratory scale with great flexibility to submit samples to various spatial and temporal heating profiles. Due to the possibility to have optical access to the sample, laser heating can be combined to several non-contact diagnostics such as infrared imaging to control and analyse the temperature gradients. As case study, we present a set of experiments performed to study the recrystallization kinetics of tungsten. We demonstrate that samples can be heated linearly with heating rate up to ∼2000 K/s, at temperatures above 2000K, for seconds or hours, with typical errors in the temperature measurement of around 1% that depend mainly on the determination of sample emissivity. Such studies are of crucial interest in the framework of nuclear fusion, since the ITER nuclear reactor will operate with a full-W divertor.

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Section: Applicationmentioning

confidence: 99%

A high power laser facility to conduct annealing tests at high temperature

Minissale

Durif

Hiret

et al. 2020

Review of Scientific Instruments

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“…Since the material on the surface of the singlecrystal silicon is removed by melting and vaporization, the removed material is carried out in the machining area by the moving electrode and flowing working fluid. However, some of the melted and vaporized materials that remain in the machining area are cooled by the working fluid and resolidify on the surface of the single-crystal silicon, thus forming the recast layer [26]. As shown in Figure 7, a recast layer with a thickness of approximately 15 μm is formed on the surface of monocrystalline silicon after discharge forming cutting.…”

Section: Removal Mechanism Of Discharge Forming Cutting-electrochemicalmentioning

confidence: 99%

“…erefore, it is necessary to reduce the deposition of the metamorphic layer by rotating the electrode or increasing the amount of flushing liquid during processing to improve the surface quality after processing. Murray et al [26] found that in the process of WEDM, the electrode material (tungsten grains) was deposited on the surface of single-crystal silicon, thereby forming a metamorphic layer, which further affects the surface quality of the processed material (single-crystal silicon). Yeh et al [27] found that when a phosphorous dielectric was used as the electrolyte for WEDM, the surface modification layer depth of single-crystal silicon after cutting was 20 μm, and the content of phosphorous reached 0.49 wt%.…”

Section: Introductionmentioning

confidence: 99%

Experimental Research on Discharge Forming Cutting-Electrochemical Machining of Single-Crystal Silicon

Xin

Liu

2021

Mathematical Problems in Engineering

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During the wire electrical discharge machining (WEDM) process, a large number of discharge pits and a recast layer are easily generated on the workpiece surface, resulting in high surface roughness. A discharge forming cutting-electrochemical machining method for fabricating single-crystal silicon is proposed in this study to solve this problem. On the same processing equipment, single-crystal silicon is first cut using the discharge forming cutting method. Second, electrochemical anodic reaction technology is used to dissolve the discharge pits and recast layer on the single-crystal silicon surface. The machining mechanism of this process, the surface elements of the processed single-crystal silicon and a comparison of the kerf width are analyzed through experiments. On this basis, the influence of the movement speed of the copper foil electrode during electrochemical anodic dissolution on the final surface roughness is qualitatively analyzed. The experimental results show that discharge forming cutting-electrochemical machining can effectively eliminate the electrical discharge pits and recast layer, which are caused by electric discharge cutting, on the surface of single-crystal silicon, thereby reducing the surface roughness of the workpiece.

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“…While the examination of the recast layer, spherical electrode deposits, and a lot of one of the deposits of the wire-electrode material at the gas void side were detected in it, which were evident on the dark-and bright-field TEM micrographs. Murray et al [10] was interested in the TEM analysis on the WEDM surface of a single-crystal silicon. For the experiments, focused ion beam machining was carried out to produce a lamellar out of one of the machined holes.…”

Section: Introductionmentioning

confidence: 99%

Study of Micro Structural Material Changes after WEDM Based on TEM Lamella Analysis

Mouralová

Zahradníček

Beneš

et al. 2020

Metals

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Wire electrical discharge machining is an unconventional machining technology that is crucial in many industries. The surface quality of the machined parts is carefully monitored, but the condition of the subsurface layer also plays a crucial role, especially in case of defects occurrence such as cracks or burnt cavities. The subsurface layer of individual materials is affected differently due to wire electrical discharge machining. For this reason, this study was carried out focusing on a detailed analysis of transmission electron microscope (TEM) lamella made of Ti-6Al-4V titanium alloy, AlZn6Mg2Cu aluminum alloy, pure molybdenum, Creusabro 4800 steel, and Hardox 400 steel. The attention was first of all paid to the concentration and distribution of individual elements in the recast layer and also in the base material, which was often affected by wire electrical discharge machining. Further, a diffraction analysis was performed for each TEM lamella in the adhesive area and in the base material area. In order to assess the macro-effects on the machined material, the topography analysis of the machined surfaces and the morphology analysis were performed using electron microscopy.

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TEM study on the electrical discharge machined surface of single-crystal silicon

Cited by 39 publications

References 25 publications

A high power laser facility to conduct annealing tests at high temperature

A high power laser facility to conduct annealing tests at high temperature

Experimental Research on Discharge Forming Cutting-Electrochemical Machining of Single-Crystal Silicon

Study of Micro Structural Material Changes after WEDM Based on TEM Lamella Analysis

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