2016 3rd International Conference on Information Science and Control Engineering (ICISCE) 2016
DOI: 10.1109/icisce.2016.150
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Temperature Analysis in the Fused Deposition Modeling Process

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Cited by 56 publications
(35 citation statements)
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“…Previous modeling works have mostly focused on the thermal and thermo-mechanical behavior of the printed part, after the deposition of the material. Analytical and numerical thermal models have been developed to compute the local temperature history of the printed strand, using lumped capacitance analysis [6][7][8][9][10][11][12][13]. Thermal models have further been coupled to a sintering model [14] (driven by the capillary forces) and healing models [12,15,16] (driven by the intermolecular diffusion), to predict the local bond formation between adjoining strands.…”
Section: Accepted Manuscriptmentioning
confidence: 99%
“…Previous modeling works have mostly focused on the thermal and thermo-mechanical behavior of the printed part, after the deposition of the material. Analytical and numerical thermal models have been developed to compute the local temperature history of the printed strand, using lumped capacitance analysis [6][7][8][9][10][11][12][13]. Thermal models have further been coupled to a sintering model [14] (driven by the capillary forces) and healing models [12,15,16] (driven by the intermolecular diffusion), to predict the local bond formation between adjoining strands.…”
Section: Accepted Manuscriptmentioning
confidence: 99%
“…Previous research has agreed that lower travel and extrusion velocities yield better build qualities within FFF processes, lower print temperatures can also help with the distortion of FFF depositions [35]. Zhou et al conclude in their 2017 paper on thermal behaviour of PLA in FFF; "reducing extrusion temperature, slowing printing speed, and decreasing layer thickness could help to reduce the vertical distortion and residual thermal stress" [36].…”
Section: Controlling Under/over Extrusionmentioning
confidence: 99%
“…El Moumen et al [43] discussed a 3D thermomechanical model that simulates the 3D printing process using FEA. Zhou et al [44] described a finite element based on element activation to model the thermal history of a 3D-printed part. Zhou et al [45] described a voxelization-based finite element simulation to simulate the thermal history of 3D-printed parts.…”
Section: Introductionmentioning
confidence: 99%