Temperature and indenter radius effects on mechanical properties of copper during nanoindentation: a molecular dynamic simulation study

Abstract

Molecular dynamics simulations of nanoindentation have been performed using a spherical indenter that penetrates a surface of an FCC copper model. The effects of the indenter radius and temperature on the mechanical properties and deformation mechanisms are investigated. Several deformation mechanisms, including atomic structural changes, dislocations, and pile-up of atoms around the indenter, are observed depending on the indenter radius and temperature. Increasing the simulation temperature decreases the hardness and reduced modulus. The reduced modulus decreases with the decreasing of the indenter radius while the hardness does not change significantly. MethodsThe copper sample used in the simulation contains 6806 atoms and the dimension is 148.215 × 148.215 × 3.615 0123456789().: V,-vol

Temperature effect on nanotwinned Ni under nanoindentation using molecular dynamic simulation

“…The repulsive potential has been extensively validated in various loading conditions, including tensile [27,28] and shear. [29] In recent years, especially in indentation simulation, [30][31][32] researchers have achieved good results in capturing stress responses, atomic deformations of Ni across different temperature ranges: [33][34][35][36][37]…”