2000
DOI: 10.1049/ip-map:20000568
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Temperature compensated high-dielectric-constant thermoplastic microwave materials

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Cited by 6 publications
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“…In these properties, temperature coefficient of frequency (τ f ) has received intensive attention for reducing temperatureinduced drift. The τ f depends both on the coefficient of thermal expansion (CTE) and the dielectric constant of temperature coefficient (a " ) [3][4][5]. However, polymer, widely used in packaging and substrates, has the main disadvantages of its high linear CTE and large negative a " .…”
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confidence: 99%
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“…In these properties, temperature coefficient of frequency (τ f ) has received intensive attention for reducing temperatureinduced drift. The τ f depends both on the coefficient of thermal expansion (CTE) and the dielectric constant of temperature coefficient (a " ) [3][4][5]. However, polymer, widely used in packaging and substrates, has the main disadvantages of its high linear CTE and large negative a " .…”
mentioning
confidence: 99%
“…However, polymer, widely used in packaging and substrates, has the main disadvantages of its high linear CTE and large negative a " . A mechanism for the temperature compensation of τ f in polymer composites has been obtained by introducing ceramic filler with a different a " into polymer matrix [3]. For efficient filling of polymers by ceramics filler with different dielectric properties, high dielectric constant microwave composites with near-zero τ f can be achieved and it would be an effective way to reduce CTE and a " [6].…”
mentioning
confidence: 99%