Temperature cycle reliability analysis and life prediction of plastic encapsulated power semiconductor devices

Tian, Wenchao; Wang, Chuqiao; Zhao, Zhanghan; Feng, Xuegui; Wen, Zhengguo

doi:10.1109/icept50128.2020.9202942

Cited by 4 publications

(5 citation statements)

References 7 publications

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“…α was 0.05 (>0.033), so the original hypothesis was overruled. That is, the thermal fatigue life of the completely solder overflow was higher than that of the incomplete solder overflow [20]. Therefore, incomplete solder overflow should be avoided when bonding FBAR filter chips.…”

Section: The Permutation Testmentioning

confidence: 97%

“…Due to the limitations of welding technology, solder overflow occurs when the filter chip is in the bonding process. The bonded solder melts and flows around the chip [20]. Solder will produce local stress concentration after cooling, which is more prone to delamination failure under temperature cycling conditions, affecting the thermal fatigue life of the device.…”

Section: Establishment Of the Overflow Solder Modelmentioning

confidence: 99%

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Temperature Cycle Reliability Analysis of an FBAR Filter-Bonded Ceramic Package

Tian,

Li,

Zhang

et al. 2023

Micromachines

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On the background that the operating frequency of electronic devices tends to the radio frequency (RF) segment, a film bulk acoustic resonator (FBAR) filter is widely used in communication and military fields because of its advantages of high upper frequency, ample power capacity, small size, and low cost. However, the complex and harsh working environment puts higher requirements for packaging FBAR filters. Based on the Anand constitutive equation, the stress–strain response of the bonded ceramic package was studied by the finite element method for the FBAR filter-bonded ceramic package, and the thermal fatigue life of the device was predicted. We developed solder models with various spillage morphologies based on the random generation technique to examine the impact of spillage on device temperature reliability. The following are the primary conclusions: (1) Solder undergoes periodic deformation, stress, and strain changes throughout the cycle. (2) The corner of the contact surface between the chip and the solder layer has the largest stress at the end of the cycle, measuring 19.377 MPa. (3) The Engelmaier model predicts that the gadget will have a thermal fatigue life of 1928.67 h. (4) Expanding the layered solder area caused by any solder overflow mode may shorten the device’s thermal fatigue life. The thermal fatigue life of a completely spilled solder is higher than that of a partially spilled solder.

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Section: The Permutation Testmentioning

confidence: 97%

Section: Establishment Of the Overflow Solder Modelmentioning

confidence: 99%

Temperature Cycle Reliability Analysis of an FBAR Filter-Bonded Ceramic Package

Tian,

Li,

Zhang

et al. 2023

Micromachines

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“…In addition, the continuous simplification of wet diffusion models is also an ongoing research direction to reduce their model complexity, which deserves attention. In the previous explorations of the mechanism of delamination failure of plasticized devices, the main focus is on the mismatch of the CTE (coefficient of thermal expansion) of different materials to explain the delamination phenomenon by the exacerbation of thermal stresses [10,40,41]. However, in addition to the thermal strain caused by thermal expansion of the device, there are also wet strains caused by the mismatch of the CHS (coefficient of hygroscopic swelling) of various materials inside the device due to the difference in hygroscopic capacity, as well as vapor pressure strain caused by the conversion of water molecules in the sealing material into water vapor due to heat.…”

Section: How To Characterize Moisture Diffusionmentioning

confidence: 99%

“…Researchers’ studies on delamination mechanisms have mainly focused on thermal stress damage and moisture damage. Explaining the delamination phenomenon from the stress–strain perspective alone, it has been found that, at the delamination interface, mainly due to the interface between the two phases of the material, the plastic deformation of the two-phase material is formed under the action of the alternating shear stress, which ultimately leads to the failure of delamination [ 8 , 9 , 10 , 11 , 12 , 13 , 14 ]. At the same time, under the intrusion of moisture, ionic contaminants corrode the chip, and moisture thermal expansion is also the main reason for the device to appear to suffer from the “popcorn” effect [ 15 , 16 , 17 , 18 , 19 ].…”

Section: Introductionmentioning

confidence: 99%

Delamination of Plasticized Devices in Dynamic Service Environments

Tian,

Chen,

Zhang

et al. 2024

Micromachines

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With the continuous development of advanced packaging technology in heterogeneous semiconductor integration, the delamination failure problem in a dynamic service environment has gradually become a key factor limiting the reliability of packaging devices. In this paper, the delamination failure mechanism of polymer-based packaging devices is clarified by summarizing the relevant literature and the latest research solutions are proposed. The results show that, at the microscopic scale, thermal stress and moisture damage are still the two main mechanisms of two-phase interface failure of encapsulation devices. Additionally, the application of emerging technologies such as RDL structure modification and self-healing polymers can significantly improve the thermal stress state of encapsulation devices and enhance their moisture resistance, which can improve the anti-delamination reliability of polymer-based encapsulation devices. In addition, this paper provides theoretical support for subsequent research and optimization of polymer-based packages by summarizing the microscopic failure mechanism of delamination at the two-phase interface and introducing the latest solutions.

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“…Using the linear expansion method of Crack Tip Opening Displacement (CTOD), the relationship between geometric factors and crack length was determined, and a function equation to calculate the critical crack length of the fracture test was obtained. Wenchao Tian et al proposed a wafer-level, high-density microbump bonding technology and optimized the thickness, structure and layout of bonding materials by comparing and selecting good bonding processes [8][9][10]. Finally, they realized low-resistant electrical performance connections and obtained higher reliability, which is very useful for improving the reliability of 3D-system packaging.…”

Section: Introductionmentioning

confidence: 99%

Thermal Induced Interface Mechanical Response Analysis of SMT Lead-Free Solder Joint and Its Adaptive Optimization

et al. 2022

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Surface mount technology (SMT) plays an important role in integrated circuits, but due to thermal stress alternation caused by temperature cycling, it tends to have thermo-mechanical reliability problems. At the same time, considering the environmental and health problems of lead (Pb)-based solders, the electronics industry has turned to lead-free solders, such as ternary alloy Sn-3Ag-0.5Cu (SAC305). As lead-free solders exhibit visco-plastic mechanical properties significantly affected by temperature, their thermo-mechanical reliability has received considerable attention. In this study, the interface delamination of an SMT solder joint using a SAC305 alloy under temperature cycling has been analyzed by the nonlinear finite element method. The results indicate that the highest contact pressure at the four corners of the termination/solder horizontal interface means that delamination is most likely to occur, followed by the y-direction side region of the solder/land interface and the top arc region of the termination/solder vertical interface. It should be noted that in order to keep the shape of the solder joint in the finite element model consistent with the actual situation after the reflow process, a minimum energy-based morphology evolution method has been incorporated into the established finite element model. Eventually, an Improved Efficient Global Optimization (IEGO) method was used to optimize the geometry of the SMT solder joint in order to reduce the contact pressure at critical points and critical regions. The optimization result shows that the contact pressure at the critical points and at the critical regions decreases significantly, which also means that the probability of thermal-induced delamination decreases.

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Temperature cycle reliability analysis and life prediction of plastic encapsulated power semiconductor devices

Cited by 4 publications

References 7 publications

Temperature Cycle Reliability Analysis of an FBAR Filter-Bonded Ceramic Package

Temperature Cycle Reliability Analysis of an FBAR Filter-Bonded Ceramic Package

Delamination of Plasticized Devices in Dynamic Service Environments

Thermal Induced Interface Mechanical Response Analysis of SMT Lead-Free Solder Joint and Its Adaptive Optimization

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