Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder

Han, Yan-Feng; Jing, Hong Yang; Nai, Mui Ling Sharon; Tan, Cher Ming; Wei, Jun

doi:10.1007/s11664-009-0970-5

Cited by 57 publications

(18 citation statements)

References 31 publications

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“…Nanoindentation has a unique advantage in studying the mechanical behavior of materials of very small sizes including actual electronic components at the order of micro meters. Two common testing schemes are used in indentation creep study, namely constant load (CL) test [15,16] and constant strain rate (CSR) test [17]. The latter is proven to be more suitable to correlate with the conventional constant strain rate test [18], where the steady states of stress and strain rate are achievable under the instrument accessible conditions.…”

Section: Introductionmentioning

confidence: 99%

Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation

Shen

Septiwerdani

Chen

2012

Materials Science and Engineering: A

137

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Section: Introductionmentioning

confidence: 99%

Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation

Shen

Septiwerdani

Chen

2012

Materials Science and Engineering: A

137

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“…As shown in Fig.2, it consists of three parts: loading, holding, and unloading. [5] In the loading, a load is applied with the constant load rate.…”

Section: Nanoindentation Testmentioning

confidence: 99%

Effect of Ni on the morphology of IMC and mechanical properties of SAC-Bi-Ni/Cu joints

Zou

Sun

Liu

2011

2011 International Symposium on Advanced Packaging Materials (APM)

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The effects of Ni element on the morphology of intermetallic compounds and some mechanical properties of SAC-Bi-XNi/Cu lead-free solder joints have been investigated. The corresponding mechanical and reliability behaviors were evaluated by performing shear test, fracture mode analysis, nanoindentation experiments and measurement of IMC before and after isothermal aging 200h and 400h at 160 . The results indicate d that with increasing the content of Ni (0~0.15 wt %), hardness of solder increased, shear strength of solder joints and modulus of elasticity of solder increased and then decreased. SAC-Bi-0.1Ni leadfree solder showed the largest shear strength and Young's modulus. The fracture dimples in SAC-Bi-0.1Ni solder joints were less than other three solders. The thickness of IMC increased originally and then decreased after reflowing, which was thinnest in SAC-Bi-0.05Ni/Cu solder joint. Ni apparently refined the grains of IMC.

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“…It is crucial, therefore, to gain insight into the creep behavior of solder joins at room temperatures, as this will directly influence the reliability of solder joins interconnects. Furthermore, the hardness and Young's modulus of solders are important properties which influence the reliability of solder joins [9] . Therefore, it's necessary to add some RE elements into low-Ag solders in an effort to improve the comprehensive properties.…”

Section: Introductionmentioning

confidence: 99%

“…Nanoindentation tests are often used as a simple and easy method for the investigation of the mechanical behavior of materials and technically simpler than tensile tests [11] . In this study, nanoindentation technique was used to investigate the mechanical properties of Sn-Ag-Cu-xCe 1ead-free microsolder joints at room temperature, namely the hardness, Young's modulus and stress exponents.…”

Section: Introductionmentioning

confidence: 99%

Study on the meso-mechanical characteristics of SAC0307-xCe micro-solder joints

Wang

Dai

et al. 2012

2012 7th International Forum on Strategic Technology (IFOST)

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With the size of Lead-free solder joint decreasing, the reliability of solder joint is particularly prominent, which the mechanical properties of solder joint are critical to its reliability. Meso-mechanical properties and creep behavior of the SAC0307-xCe/Cu micro-solder joints were studied by Berkovich nanoindentation tests with different loading rates at room temperature. The load-depth curves were rate dependent. As the rate increased, the creep depth was increased at same hold time. The Young's modulus of SAC0307-xCe/Cu solder joints are 46.9±0.9 GPa, 50.3±1.0 GPa, 51.4±0.8 GPa and 52.5±1.1 GPa, respectively, and indention hardness are 151.37±3.25 N/mm2, 152.85±2.96 N/mm2, 156.79±3.06 N/mm2, and 167.33±3.58 N/mm2, respectively. It can be seen that Young's modulus and indention hardness increase with the increasing of Ce content. The strain rate sensitivity of creep m was fitted linearly by analysis of Anti-Physics of indentation hardness Hcr and strain rate έ cr of creep. The stress index of creep n was calculated. The m values are 0.3944, 0.3229, 0.2029, 0.1233 respeetively and the n values are 2.5355, 3.0969, 4.9285, 8.1103 respeetively on SAC0307-xCe/Cu micro-solder joints, with the increasing of Ce content, the creep resistance property of SAC0307-xCe solder joints has changed much, m decreased and n increased. Results shows that adding trace amounts of Ce elements into low-Ag solder have notable effort to improve the meso-mechanical properties and creep resistance, Ce element will play an important role in providing better electronic interconnections.

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Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder

Cited by 57 publications

References 31 publications

Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation

Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation

Effect of Ni on the morphology of IMC and mechanical properties of SAC-Bi-Ni/Cu joints

Study on the meso-mechanical characteristics of SAC0307-xCe micro-solder joints

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