Abstract:We evaluated the possibility of monolithic integration of electron devices and surface acoustic wave (SAW) devices on GaN. We removed top n+ GaN layers of n+ GaN/unintentionally-doped GaN structures by inductively coupled plasma (ICP) etching and fabricated SAW filters on the exposed unintentionally doped GaN layers. We found that the device characteristics are almost the same as those of devices fabricated on as-grown GaN layers, although the surface morphology of GaN layers is degraded due to the ICP etching. The results indicate that SAW devices and electron devices can be monolithically integrated on GaN-based semiconductor structures. Keywords: GaN, sapphire, surface acoustic wave, SAW, HEMT, monolithic integration Classification: New functional devices and materials
References[1] K. Shiojima, T. Makimura, T. Kosugi, S. Sugitani, N. Shigekawa, H.Ishikawa, and T. Egawa, "High-power AlGaN/GaN dual-gate high electron mobility transistor mixers on SiC substrates," Electron. Lett., vol. 40, no. 12, pp. 775-776, June 2004. Kim, "Experimental and theoretical characterization of the surface acoustic wave propagation properties of GaN epitaxial layers on c-plane sapphire,"