Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition

Cho, Seungmin; Han, Bongtae; Joo, Jinho

doi:10.1115/1.1646426

Cited by 25 publications

(5 citation statements)

References 19 publications

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“…The high temperature dwell can be either due to operating surroundings (as in automotive and aerospace applications) or due to continued operation of the package (as in server applications). However, most of the experimental studies [1][2][3] have focused either on solder deformation behavior during high temperature dwell lasting less than 1 h or on long duration dwell at room temperature. A combination of creep deformation behavior of the solder joints at a high temperature and for a long duration has not been performed and should therefore be studied.…”

Section: Nomenclaturementioning

confidence: 99%

Using Carrier Fringes to Study the High Temperature Deformation Behavior of a BGA Package Under Extended Dwell Times

Tunga

Sitaraman

2008

Exp Mech

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There is a compelling need to experimentally understand solder joint deformation behavior at high temperatures over an extended period of time. Accordingly, the deformation behavior of solder joints in a Ceramic Ball Grid Array (CBGA) package mounted on an organic FR4 board under extended dwell time at a high temperature has been studied using laser moiré interferometry. The warpage and the in-plane horizontal deformation of the ceramic substrate and the organic board as a function of time were determined. The variation of the normal strains and shear strains in the solder joints with time were also investigated. It was found that increased sensitivity was necessary to accurately determine the strains in the small sized solder joints. A new method utilizing carrier fringes to increase the sensitivity of the moiré interferometry system is proposed and has been used to determine the strains in the small sized solder joints. Increased sensitivity can be obtained merely by changing the incident angle of the laser light on the surface of the specimen, thereby making it unnecessary to use expensive phase shifting apparatus with the traditional laser moiré system.

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Section: Nomenclaturementioning

confidence: 99%

Using Carrier Fringes to Study the High Temperature Deformation Behavior of a BGA Package Under Extended Dwell Times

Tunga

Sitaraman

2008

Exp Mech

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“…They were employed to study the temperature-dependent thermo-mechanical behavior. The schemes were implemented with convectiontype or conduction-type environmental chambers that provide the temperature control required in accelerated thermal cycling (isothermal loading) [35,41,[50][51][52][53][54][55][56][57][58][59][60][61][62][63][64][65]. Park et al…”

Section: Microelectronics Devicementioning

confidence: 99%

Recent Applications of Moiré Interferometry

Ifju

Han

2010

Exp Mech

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Moiré interferometry has been a valuable experimental technique for the understanding of the mechanical behavior of materials and structures. Over the last decade less emphasis has been placed on the development of the technique and more towards applications. This paper is a review article on recent applications using moiré interferometry in the fields of microelectronics devices, material characterization, micromechanics, residual stress, composite materials, fracture mechanics, and biomechanics. The general principles of moiré interferometry and advancement of techniques will not be discussed in this text, but references will be provided.

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“…The convection-based scheme in the literature [1,2] simulates the ATC condition and it has been incorporated into real-time moire interferometry successfully to measure the temperature-dependent thermal deformations of various package assemblies. Although effective, the ramp rate provided by the convection oven is limited and the system cannot accommodate the fast ramp rate encountered in the thermal shock test.…”

Section: Conduction Based Environmental Chambermentioning

confidence: 99%

In Situ Displacement Measurement of Flex Package Subject to Thermal Shock Conditions

Yoon

Cho

Lee

et al. 2006

KEM

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A unique interferometric system utilizing thermal-conduction loading is developed and implemented to investigate the effect of ramp rates of accelerated test profiles on the thermal deformation of flex package assemblies. The system provides extreme ramp rates to simulate the thermal shock condition with a temperature control much finer than the conventional convection based system can provide. The in-plane and out-of-plane displacements of the flex package are documented through moiré interferometry and Twyman/Green interferometry, respectively. Deformation measured under a thermal shock condition is compared with that under the conventional thermal cycling condition to assess the effect of ramp rates on package deformation. The comparison reveals that a low ramp rate of typical accelerated thermal cycling (ATC) tests causes significant reduction in the maximum level of elastic energy in the package assembly.

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Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition

Cited by 25 publications

References 19 publications

Using Carrier Fringes to Study the High Temperature Deformation Behavior of a BGA Package Under Extended Dwell Times

Using Carrier Fringes to Study the High Temperature Deformation Behavior of a BGA Package Under Extended Dwell Times

Recent Applications of Moiré Interferometry

In Situ Displacement Measurement of Flex Package Subject to Thermal Shock Conditions

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